JPS618936A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS618936A
JPS618936A JP59129288A JP12928884A JPS618936A JP S618936 A JPS618936 A JP S618936A JP 59129288 A JP59129288 A JP 59129288A JP 12928884 A JP12928884 A JP 12928884A JP S618936 A JPS618936 A JP S618936A
Authority
JP
Japan
Prior art keywords
lead frame
frame
rack
pellet
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59129288A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0444417B2 (enExample
Inventor
Koji Taniguchi
谷口　耕司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Semiconductor Package and Test Solutions Co Ltd
Original Assignee
Hitachi Hokkai Semiconductor Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Hokkai Semiconductor Ltd, Hitachi Ltd filed Critical Hitachi Hokkai Semiconductor Ltd
Priority to JP59129288A priority Critical patent/JPS618936A/ja
Publication of JPS618936A publication Critical patent/JPS618936A/ja
Publication of JPH0444417B2 publication Critical patent/JPH0444417B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP59129288A 1984-06-25 1984-06-25 半導体装置の製造方法 Granted JPS618936A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59129288A JPS618936A (ja) 1984-06-25 1984-06-25 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59129288A JPS618936A (ja) 1984-06-25 1984-06-25 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS618936A true JPS618936A (ja) 1986-01-16
JPH0444417B2 JPH0444417B2 (enExample) 1992-07-21

Family

ID=15005866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59129288A Granted JPS618936A (ja) 1984-06-25 1984-06-25 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS618936A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62142830U (enExample) * 1986-02-28 1987-09-09
JPH05240783A (ja) * 1992-02-28 1993-09-17 Shimadzu Corp 分光光度計
JPH0569048U (ja) * 1992-02-26 1993-09-17 オーチス エレベータ カンパニー エレベーターの敷居

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59101437U (ja) * 1982-12-27 1984-07-09 株式会社松村製作所 リ−ドフレ−ム反転装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59101437U (ja) * 1982-12-27 1984-07-09 株式会社松村製作所 リ−ドフレ−ム反転装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62142830U (enExample) * 1986-02-28 1987-09-09
JPH0569048U (ja) * 1992-02-26 1993-09-17 オーチス エレベータ カンパニー エレベーターの敷居
JPH05240783A (ja) * 1992-02-28 1993-09-17 Shimadzu Corp 分光光度計

Also Published As

Publication number Publication date
JPH0444417B2 (enExample) 1992-07-21

Similar Documents

Publication Publication Date Title
KR101229260B1 (ko) 본딩 장치용 전자 디바이스 핸들러
US7677431B2 (en) Electronic device handler for a bonding apparatus
JP3198401B2 (ja) ウェーハリングの供給・返送装置
JPH0964148A (ja) ウェーハリングの供給・返送装置
JPS618936A (ja) 半導体装置の製造方法
JP6660219B2 (ja) ダイボンダ
JPH1154534A (ja) ポッティング方法および機構ならびにそれを用いたダイボンダ
KR0119761Y1 (ko) 다이본딩 장비의 에폭시 도포장치
JP2002164361A (ja) 半導体製造装置および半導体製造方法
JPH01316147A (ja) ワーク搬送装置
US4762267A (en) Wire bonding method
JPS5870539A (ja) 超音波ボンデイング装置
KR19990082842A (ko) 씨에스피용박막필름의이송및클램프장치
JPH0322698B2 (enExample)
JPS6147646A (ja) 半導体製造装置
KR970008360B1 (ko) 반도체 제조장비의 리드프레임 이송장치
JPS60183733A (ja) ダイボンデイング装置
JPH0669254A (ja) リードフレーム位置決めストッパ機構およびそれを用いたワイヤボンダ
JPH0764401B2 (ja) 搬送装置
KR100187717B1 (ko) 상면에 플라스틱 판이 체결된 와이어 본딩 장치의 리드 프레임 이송단
JPH04245653A (ja) チップマウント装置
KR19980018458U (ko) 와이어본딩장비의 피더
JPS6094282A (ja) リ−ドフレ−ム供給装置
JPH0737907A (ja) 半導体処理装置およびその処理方法
JPS59193032A (ja) 半導体装置の製造装置