JPS6177278A - 回路の接続部材 - Google Patents
回路の接続部材Info
- Publication number
- JPS6177278A JPS6177278A JP19924684A JP19924684A JPS6177278A JP S6177278 A JPS6177278 A JP S6177278A JP 19924684 A JP19924684 A JP 19924684A JP 19924684 A JP19924684 A JP 19924684A JP S6177278 A JPS6177278 A JP S6177278A
- Authority
- JP
- Japan
- Prior art keywords
- connecting member
- conductive particles
- circuit
- melting point
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002245 particle Substances 0.000 claims description 66
- 230000001070 adhesive effect Effects 0.000 claims description 33
- 239000000853 adhesive Substances 0.000 claims description 31
- 238000002844 melting Methods 0.000 claims description 26
- 230000008018 melting Effects 0.000 claims description 24
- 239000011162 core material Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 238000002834 transmittance Methods 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 239000010410 layer Substances 0.000 description 11
- 238000009413 insulation Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 239000002923 metal particle Substances 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- -1 polyethylene, ethylene-propylene copolymer Polymers 0.000 description 4
- 206010040844 Skin exfoliation Diseases 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- HFGHRUCCKVYFKL-UHFFFAOYSA-N 4-ethoxy-2-piperazin-1-yl-7-pyridin-4-yl-5h-pyrimido[5,4-b]indole Chemical compound C1=C2NC=3C(OCC)=NC(N4CCNCC4)=NC=3C2=CC=C1C1=CC=NC=C1 HFGHRUCCKVYFKL-UHFFFAOYSA-N 0.000 description 1
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 101100381300 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) atp-5 gene Proteins 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical class C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000011038 discontinuous diafiltration by volume reduction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 229920006228 ethylene acrylate copolymer Polymers 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007757 hot melt coating Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920005596 polymer binder Polymers 0.000 description 1
- 239000002491 polymer binding agent Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 229920006230 thermoplastic polyester resin Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19924684A JPS6177278A (ja) | 1984-09-21 | 1984-09-21 | 回路の接続部材 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19924684A JPS6177278A (ja) | 1984-09-21 | 1984-09-21 | 回路の接続部材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6177278A true JPS6177278A (ja) | 1986-04-19 |
JPS6331905B2 JPS6331905B2 (enrdf_load_stackoverflow) | 1988-06-27 |
Family
ID=16404598
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19924684A Granted JPS6177278A (ja) | 1984-09-21 | 1984-09-21 | 回路の接続部材 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6177278A (enrdf_load_stackoverflow) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6178069A (ja) * | 1984-09-26 | 1986-04-21 | 日立化成工業株式会社 | 回路の接続部材 |
JPS63301408A (ja) * | 1987-06-02 | 1988-12-08 | Hitachi Chem Co Ltd | 導電性粒子 |
JPH0521094A (ja) * | 1991-07-12 | 1993-01-29 | Hitachi Chem Co Ltd | 異方導電性接着剤 |
JPH08249922A (ja) * | 1995-10-31 | 1996-09-27 | Hitachi Chem Co Ltd | 被覆粒子 |
WO2002061766A1 (en) * | 2001-01-24 | 2002-08-08 | Kaken Tech Co., Ltd. | Conductive powder and conductive composition |
JP2002256303A (ja) * | 2001-03-06 | 2002-09-11 | Fujitsu Ltd | 伝導性粒子、伝導性組成物、電子機器および電子機器製造方法 |
JP2007026776A (ja) * | 2005-07-13 | 2007-02-01 | Sumitomo Electric Ind Ltd | 導電性微粒子およびそれを用いた接着剤 |
JP2007207861A (ja) * | 2006-01-31 | 2007-08-16 | Showa Shell Sekiyu Kk | Inハンダ被覆銅箔リボン導線及びその接続方法 |
JP2010182492A (ja) * | 2009-02-04 | 2010-08-19 | Hitachi Cable Ltd | 端子及び端子と電線の接続方法 |
WO2012128386A1 (ja) * | 2011-03-24 | 2012-09-27 | ソニーケミカル&インフォメーションデバイス株式会社 | 太陽電池モジュール、太陽電池モジュールの製造方法、導電性接着剤 |
JP2015537115A (ja) * | 2012-10-03 | 2015-12-24 | アエムセ ホールディングAmc Holding | 導電性を改善するための電気的接続粉末およびペースト |
JP2018046010A (ja) * | 2016-09-09 | 2018-03-22 | 積水化学工業株式会社 | 金属原子含有粒子、接続材料、接続構造体及び接続構造体の製造方法 |
JPWO2017159694A1 (ja) * | 2016-03-15 | 2019-01-17 | 積水化学工業株式会社 | 金属含有粒子、接続材料、接続構造体及び接続構造体の製造方法 |
JP2019029135A (ja) * | 2017-07-27 | 2019-02-21 | 日立化成株式会社 | 異方性導電フィルム及びその製造方法、並びに接続構造体及びその製造方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4108340B2 (ja) * | 2002-01-23 | 2008-06-25 | 宇部日東化成株式会社 | 導電性シリカ系粒子 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5823174A (ja) * | 1981-07-31 | 1983-02-10 | 信越ポリマー株式会社 | 接続端子の電気接続方法 |
JPS6084718A (ja) * | 1983-10-14 | 1985-05-14 | 日立化成工業株式会社 | 導電異方性接着シ−ト |
JPS6177279A (ja) * | 1984-09-21 | 1986-04-19 | 日立化成工業株式会社 | 回路の接続部材 |
-
1984
- 1984-09-21 JP JP19924684A patent/JPS6177278A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5823174A (ja) * | 1981-07-31 | 1983-02-10 | 信越ポリマー株式会社 | 接続端子の電気接続方法 |
JPS6084718A (ja) * | 1983-10-14 | 1985-05-14 | 日立化成工業株式会社 | 導電異方性接着シ−ト |
JPS6177279A (ja) * | 1984-09-21 | 1986-04-19 | 日立化成工業株式会社 | 回路の接続部材 |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6178069A (ja) * | 1984-09-26 | 1986-04-21 | 日立化成工業株式会社 | 回路の接続部材 |
JPS63301408A (ja) * | 1987-06-02 | 1988-12-08 | Hitachi Chem Co Ltd | 導電性粒子 |
JPH0521094A (ja) * | 1991-07-12 | 1993-01-29 | Hitachi Chem Co Ltd | 異方導電性接着剤 |
JPH08249922A (ja) * | 1995-10-31 | 1996-09-27 | Hitachi Chem Co Ltd | 被覆粒子 |
WO2002061766A1 (en) * | 2001-01-24 | 2002-08-08 | Kaken Tech Co., Ltd. | Conductive powder and conductive composition |
JP2002256303A (ja) * | 2001-03-06 | 2002-09-11 | Fujitsu Ltd | 伝導性粒子、伝導性組成物、電子機器および電子機器製造方法 |
JP2007026776A (ja) * | 2005-07-13 | 2007-02-01 | Sumitomo Electric Ind Ltd | 導電性微粒子およびそれを用いた接着剤 |
JP2007207861A (ja) * | 2006-01-31 | 2007-08-16 | Showa Shell Sekiyu Kk | Inハンダ被覆銅箔リボン導線及びその接続方法 |
JP2010182492A (ja) * | 2009-02-04 | 2010-08-19 | Hitachi Cable Ltd | 端子及び端子と電線の接続方法 |
WO2012128386A1 (ja) * | 2011-03-24 | 2012-09-27 | ソニーケミカル&インフォメーションデバイス株式会社 | 太陽電池モジュール、太陽電池モジュールの製造方法、導電性接着剤 |
JP2012204528A (ja) * | 2011-03-24 | 2012-10-22 | Sony Chemical & Information Device Corp | 太陽電池モジュール、太陽電池モジュールの製造方法、導電性接着剤 |
JP2015537115A (ja) * | 2012-10-03 | 2015-12-24 | アエムセ ホールディングAmc Holding | 導電性を改善するための電気的接続粉末およびペースト |
JPWO2017159694A1 (ja) * | 2016-03-15 | 2019-01-17 | 積水化学工業株式会社 | 金属含有粒子、接続材料、接続構造体及び接続構造体の製造方法 |
TWI841520B (zh) * | 2016-03-15 | 2024-05-11 | 日商積水化學工業股份有限公司 | 含金屬之粒子、連接材料、連接結構體及連接結構體之製造方法 |
JP2018046010A (ja) * | 2016-09-09 | 2018-03-22 | 積水化学工業株式会社 | 金属原子含有粒子、接続材料、接続構造体及び接続構造体の製造方法 |
JP2022050542A (ja) * | 2016-09-09 | 2022-03-30 | 積水化学工業株式会社 | 金属原子含有粒子、接続材料、接続構造体及び接続構造体の製造方法 |
JP2019029135A (ja) * | 2017-07-27 | 2019-02-21 | 日立化成株式会社 | 異方性導電フィルム及びその製造方法、並びに接続構造体及びその製造方法 |
JP2022186787A (ja) * | 2017-07-27 | 2022-12-15 | 昭和電工マテリアルズ株式会社 | 異方性導電フィルム及びその製造方法、並びに接続構造体及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6331905B2 (enrdf_load_stackoverflow) | 1988-06-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |