JPH0340899B2 - - Google Patents

Info

Publication number
JPH0340899B2
JPH0340899B2 JP61049465A JP4946586A JPH0340899B2 JP H0340899 B2 JPH0340899 B2 JP H0340899B2 JP 61049465 A JP61049465 A JP 61049465A JP 4946586 A JP4946586 A JP 4946586A JP H0340899 B2 JPH0340899 B2 JP H0340899B2
Authority
JP
Japan
Prior art keywords
particles
connection
circuit
circuits
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61049465A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62206772A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4946586A priority Critical patent/JPS62206772A/ja
Priority to US07/013,904 priority patent/US4740657A/en
Priority to DE8787301263T priority patent/DE3770318D1/de
Priority to EP87301263A priority patent/EP0242025B1/en
Publication of JPS62206772A publication Critical patent/JPS62206772A/ja
Publication of JPH0340899B2 publication Critical patent/JPH0340899B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29399—Coating material

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
JP4946586A 1986-02-14 1986-03-06 回路の接続構造体 Granted JPS62206772A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP4946586A JPS62206772A (ja) 1986-03-06 1986-03-06 回路の接続構造体
US07/013,904 US4740657A (en) 1986-02-14 1987-02-12 Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
DE8787301263T DE3770318D1 (de) 1986-02-14 1987-02-13 Anisotrope elektrizitaetsleitende klebstoffzusammensetzung, verfahren zum verbinden von stromkreisen und die so erhaltenen stromkreise.
EP87301263A EP0242025B1 (en) 1986-02-14 1987-02-13 Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4946586A JPS62206772A (ja) 1986-03-06 1986-03-06 回路の接続構造体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP13590394A Division JPH0793157B2 (ja) 1994-06-17 1994-06-17 回路の接続構造体

Publications (2)

Publication Number Publication Date
JPS62206772A JPS62206772A (ja) 1987-09-11
JPH0340899B2 true JPH0340899B2 (enrdf_load_stackoverflow) 1991-06-20

Family

ID=12831886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4946586A Granted JPS62206772A (ja) 1986-02-14 1986-03-06 回路の接続構造体

Country Status (1)

Country Link
JP (1) JPS62206772A (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH072938B2 (ja) * 1986-04-16 1995-01-18 松下電器産業株式会社 異方導電性接着剤
JPH0644132Y2 (ja) * 1987-09-16 1994-11-14 日立化成工業株式会社 回路の接続構造
US5001542A (en) * 1988-12-05 1991-03-19 Hitachi Chemical Company Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
JP2811811B2 (ja) * 1989-10-03 1998-10-15 三菱電機株式会社 液晶表示装置
JPH04115407A (ja) * 1990-09-03 1992-04-16 Soken Kagaku Kk 異方導電性接着剤組成物
JP2008270846A (ja) * 2003-10-03 2008-11-06 Fuji Electric Device Technology Co Ltd 半導体装置の製造方法
JP2016089153A (ja) 2014-10-29 2016-05-23 デクセリアルズ株式会社 導電材料

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5057458A (enrdf_load_stackoverflow) * 1973-09-19 1975-05-19
JPS6052187B2 (ja) * 1981-05-20 1985-11-18 株式会社精工舎 導電性接着剤
JPS58182685A (ja) * 1982-04-20 1983-10-25 セイコーエプソン株式会社 表示体パネル
JPS5917534A (ja) * 1982-07-20 1984-01-28 Seiko Epson Corp 液晶パネルの上下導通方法
JPS6084718A (ja) * 1983-10-14 1985-05-14 日立化成工業株式会社 導電異方性接着シ−ト
JPS60117504A (ja) * 1983-11-28 1985-06-25 日立化成工業株式会社 高電流回路接続用導電異方性接着シ−ト
JPS60262489A (ja) * 1984-06-11 1985-12-25 ソニ−ケミカル株式会社 連結シ−ト
JPS628407A (ja) * 1985-07-04 1987-01-16 藤倉化成株式会社 異方導電性シ−ト状物の製造方法
JPS62115679A (ja) * 1985-11-15 1987-05-27 富士高分子工業株式会社 電気接続体

Also Published As

Publication number Publication date
JPS62206772A (ja) 1987-09-11

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