JPS617032U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS617032U
JPS617032U JP8987584U JP8987584U JPS617032U JP S617032 U JPS617032 U JP S617032U JP 8987584 U JP8987584 U JP 8987584U JP 8987584 U JP8987584 U JP 8987584U JP S617032 U JPS617032 U JP S617032U
Authority
JP
Japan
Prior art keywords
conductive region
conductive
semiconductor equipment
substrate
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8987584U
Other languages
English (en)
Inventor
静治 川村
道朝 飯山
Original Assignee
住友電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友電気工業株式会社 filed Critical 住友電気工業株式会社
Priority to JP8987584U priority Critical patent/JPS617032U/ja
Publication of JPS617032U publication Critical patent/JPS617032U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は半導体ウエハの分割状態を示す俯瞼図、第２図
ａ，ｂは半導体ペレット上のデバイス領域、ボンデイン
グ・パッドとペレットの周縁の関係を示す平面図、第３
図は本考案の一実施例を示す半導体装置の平面図、第４
図は第３図のＡ−Ａ′線に沿う断面図である。 １・・・半導体ペレット、２・・・スワライブ・ライン
領域、３・・・スワライブ・ライン、４・・・半導体ペ
レット周辺に発生する不整、５・・・ボンディング●パ
ツド、６・・・配線用パターンの引出し部分、７・・・
デバイス領域境界線、８・・・分割不整検出用導電領域
、９・・・ダミー・パッド。

Claims (2)

    【実用新案登録請求の範囲】
  1. （１）半導体チップのデバイス領域の周医に、チップ分
    割時不整検出用導電領域パターンを設けた・ことを特徴
    とする半導体装置。
  2. （２）導電領域として基板が導電性の場合は逆極性の導
    電領域を、又、基板が半絶縁性の場合はイオン注入等に
    より作成した導電領域を使用するととを特徴とする実用
    新案登録請求の範囲第１項記載の半導体装置。
JP8987584U 1984-06-15 1984-06-15 半導体装置 Pending JPS617032U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8987584U JPS617032U (ja) 1984-06-15 1984-06-15 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8987584U JPS617032U (ja) 1984-06-15 1984-06-15 半導体装置

Publications (1)

Publication Number Publication Date
JPS617032U true JPS617032U (ja) 1986-01-16

Family

ID=30644363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8987584U Pending JPS617032U (ja) 1984-06-15 1984-06-15 半導体装置

Country Status (1)

Country Link
JP (1) JPS617032U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59120093U (ja) * 1983-01-28 1984-08-13 月島機械株式会社 濾布洗浄水切り装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59120093U (ja) * 1983-01-28 1984-08-13 月島機械株式会社 濾布洗浄水切り装置
JPS6321999Y2 (ja) * 1983-01-28 1988-06-16

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