JPS6161847U - - Google Patents

Info

Publication number
JPS6161847U
JPS6161847U JP1984146667U JP14666784U JPS6161847U JP S6161847 U JPS6161847 U JP S6161847U JP 1984146667 U JP1984146667 U JP 1984146667U JP 14666784 U JP14666784 U JP 14666784U JP S6161847 U JPS6161847 U JP S6161847U
Authority
JP
Japan
Prior art keywords
support plate
electrode
diode chip
integrated
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984146667U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0322925Y2 (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984146667U priority Critical patent/JPH0322925Y2/ja
Publication of JPS6161847U publication Critical patent/JPS6161847U/ja
Application granted granted Critical
Publication of JPH0322925Y2 publication Critical patent/JPH0322925Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/404—Connecting portions
    • H01L2224/40475—Connecting portions connected to auxiliary connecting means on the bonding areas
    • H01L2224/40491—Connecting portions connected to auxiliary connecting means on the bonding areas being an additional member attached to the bonding area through an adhesive or solder, e.g. buffer pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Rectifiers (AREA)
JP1984146667U 1984-09-28 1984-09-28 Expired JPH0322925Y2 (en:Method)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984146667U JPH0322925Y2 (en:Method) 1984-09-28 1984-09-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984146667U JPH0322925Y2 (en:Method) 1984-09-28 1984-09-28

Publications (2)

Publication Number Publication Date
JPS6161847U true JPS6161847U (en:Method) 1986-04-25
JPH0322925Y2 JPH0322925Y2 (en:Method) 1991-05-20

Family

ID=30704901

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984146667U Expired JPH0322925Y2 (en:Method) 1984-09-28 1984-09-28

Country Status (1)

Country Link
JP (1) JPH0322925Y2 (en:Method)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01115183U (en:Method) * 1988-01-28 1989-08-02
JPH0682862U (ja) * 1991-03-14 1994-11-25 新電元工業株式会社 ブリッジ型半導体装置
JP2009110981A (ja) * 2007-10-26 2009-05-21 Mitsubishi Electric Corp 半導体モジュール
JP2014072349A (ja) * 2012-09-28 2014-04-21 Sanken Electric Co Ltd 半導体装置
JP2014072350A (ja) * 2012-09-28 2014-04-21 Sanken Electric Co Ltd 半導体装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5177341A (ja) * 1974-12-27 1976-07-05 Furukawa Electric Co Ltd Garasuhikaridensotaisogono setsuzokuhoho
JPS5320945U (en:Method) * 1976-07-30 1978-02-22
JPS5432075A (en) * 1977-08-15 1979-03-09 Nec Corp Semiconductor device
JPS5660024A (en) * 1979-10-22 1981-05-23 Hitachi Ltd Composite type semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5177341A (ja) * 1974-12-27 1976-07-05 Furukawa Electric Co Ltd Garasuhikaridensotaisogono setsuzokuhoho
JPS5320945U (en:Method) * 1976-07-30 1978-02-22
JPS5432075A (en) * 1977-08-15 1979-03-09 Nec Corp Semiconductor device
JPS5660024A (en) * 1979-10-22 1981-05-23 Hitachi Ltd Composite type semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01115183U (en:Method) * 1988-01-28 1989-08-02
JPH0682862U (ja) * 1991-03-14 1994-11-25 新電元工業株式会社 ブリッジ型半導体装置
JP2009110981A (ja) * 2007-10-26 2009-05-21 Mitsubishi Electric Corp 半導体モジュール
JP2014072349A (ja) * 2012-09-28 2014-04-21 Sanken Electric Co Ltd 半導体装置
JP2014072350A (ja) * 2012-09-28 2014-04-21 Sanken Electric Co Ltd 半導体装置

Also Published As

Publication number Publication date
JPH0322925Y2 (en:Method) 1991-05-20

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