JPS6159330B2 - - Google Patents
Info
- Publication number
- JPS6159330B2 JPS6159330B2 JP18822181A JP18822181A JPS6159330B2 JP S6159330 B2 JPS6159330 B2 JP S6159330B2 JP 18822181 A JP18822181 A JP 18822181A JP 18822181 A JP18822181 A JP 18822181A JP S6159330 B2 JPS6159330 B2 JP S6159330B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- molecular weight
- flame
- laminate
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003822 epoxy resin Substances 0.000 claims description 22
- 229920000647 polyepoxide Polymers 0.000 claims description 22
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 11
- 239000003063 flame retardant Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 11
- 229920003986 novolac Polymers 0.000 claims description 9
- 229910052736 halogen Inorganic materials 0.000 claims description 8
- 150000002367 halogens Chemical group 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 2
- 125000003342 alkenyl group Chemical group 0.000 claims description 2
- 125000002947 alkylene group Chemical group 0.000 claims description 2
- 229910052801 chlorine Inorganic materials 0.000 claims description 2
- 239000000460 chlorine Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- 239000011342 resin composition Substances 0.000 description 14
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 150000002989 phenols Chemical class 0.000 description 9
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000001879 gelation Methods 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 238000005470 impregnation Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- RIWRFSMVIUAEBX-UHFFFAOYSA-N n-methyl-1-phenylmethanamine Chemical compound CNCC1=CC=CC=C1 RIWRFSMVIUAEBX-UHFFFAOYSA-N 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- -1 phosphorus compound Chemical class 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18822181A JPS5889614A (ja) | 1981-11-24 | 1981-11-24 | 難燃性積層板の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18822181A JPS5889614A (ja) | 1981-11-24 | 1981-11-24 | 難燃性積層板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5889614A JPS5889614A (ja) | 1983-05-28 |
| JPS6159330B2 true JPS6159330B2 (de) | 1986-12-16 |
Family
ID=16219882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18822181A Granted JPS5889614A (ja) | 1981-11-24 | 1981-11-24 | 難燃性積層板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5889614A (de) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61192720A (ja) * | 1985-02-22 | 1986-08-27 | Nippon Oil Co Ltd | 積層板用樹脂組成物 |
| JPS61246228A (ja) * | 1985-04-24 | 1986-11-01 | Shin Kobe Electric Mach Co Ltd | 積層板用樹脂組成物 |
| JPS62218464A (ja) * | 1986-03-19 | 1987-09-25 | Toshiba Chem Corp | 積層板用ワニス |
| JPH0670122B2 (ja) * | 1986-11-11 | 1994-09-07 | 武田薬品工業株式会社 | エポキシ樹脂組成物 |
| JPS63234015A (ja) * | 1987-03-23 | 1988-09-29 | Shin Kobe Electric Mach Co Ltd | 積層板の製造法 |
| JPS63234014A (ja) * | 1987-03-23 | 1988-09-29 | Shin Kobe Electric Mach Co Ltd | 積層板の製造法 |
| JPH0641505B2 (ja) * | 1989-04-25 | 1994-06-01 | 松下電工株式会社 | 硬化性エポキシ樹脂組成物 |
| JPH0641504B2 (ja) * | 1989-04-25 | 1994-06-01 | 松下電工株式会社 | 硬化性エポキシ樹脂組成物 |
| JPH0641503B2 (ja) * | 1989-04-25 | 1994-06-01 | 松下電工株式会社 | 硬化性エポキシ樹脂組成物 |
| JPH0641506B2 (ja) * | 1989-04-25 | 1994-06-01 | 松下電工株式会社 | 硬化性エポキシ樹脂組成物 |
| JP4912046B2 (ja) * | 2006-06-08 | 2012-04-04 | 大同メタル工業株式会社 | クロスヘッド軸受 |
-
1981
- 1981-11-24 JP JP18822181A patent/JPS5889614A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5889614A (ja) | 1983-05-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR910008866B1 (ko) | 난연성기판 | |
| US6645630B1 (en) | Epoxy resin composition, prepreg and multilayer printed-wiring board | |
| US4021403A (en) | Flame resistant thermosetting resin composition and metal clad laminate composed of the thermosetting resin composition | |
| US5075155A (en) | Novel prepregs | |
| US4661568A (en) | Epoxy resin composition and process for preparing laminates therefrom | |
| JPS6159330B2 (de) | ||
| JPS61246228A (ja) | 積層板用樹脂組成物 | |
| US4020225A (en) | Metal clad laminate composed of flame resistant thermosetting resin composition | |
| US4529790A (en) | Epoxy resin composition | |
| JPH0127100B2 (de) | ||
| NO123354B (de) | ||
| JPH1017685A (ja) | プリプレグ及び積層板 | |
| US6306935B1 (en) | Thermosetting resin compositions for build-up method | |
| JPH09143247A (ja) | 積層板用樹脂組成物、プリプレグ及び積層板 | |
| JP3119578B2 (ja) | 印刷回路用積層板の製造方法 | |
| JPS6337138A (ja) | 積層板の製造法 | |
| JPS624406B2 (de) | ||
| JPS6119640A (ja) | 耐熱積層板の製造方法 | |
| JPS6341937B2 (de) | ||
| JPS60260618A (ja) | 難燃性エポキシ樹脂組成物 | |
| JPH0321337B2 (de) | ||
| JPS6365091B2 (de) | ||
| JPS6119639A (ja) | 積層板の製造方法 | |
| JPS63234014A (ja) | 積層板の製造法 | |
| JPS63234015A (ja) | 積層板の製造法 |