JPS6156608B2 - - Google Patents
Info
- Publication number
- JPS6156608B2 JPS6156608B2 JP4995277A JP4995277A JPS6156608B2 JP S6156608 B2 JPS6156608 B2 JP S6156608B2 JP 4995277 A JP4995277 A JP 4995277A JP 4995277 A JP4995277 A JP 4995277A JP S6156608 B2 JPS6156608 B2 JP S6156608B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- wiring
- electrode wiring
- semiconductor substrate
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 3
- 238000000059 patterning Methods 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 238000002161 passivation Methods 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000005360 phosphosilicate glass Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4995277A JPS53135585A (en) | 1977-05-02 | 1977-05-02 | Wiring for electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4995277A JPS53135585A (en) | 1977-05-02 | 1977-05-02 | Wiring for electronic components |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5589385A Division JPS60242643A (ja) | 1985-03-22 | 1985-03-22 | 電子部品の配線 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53135585A JPS53135585A (en) | 1978-11-27 |
| JPS6156608B2 true JPS6156608B2 (US08080257-20111220-C00005.png) | 1986-12-03 |
Family
ID=12845362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4995277A Granted JPS53135585A (en) | 1977-05-02 | 1977-05-02 | Wiring for electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS53135585A (US08080257-20111220-C00005.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63305309A (ja) * | 1987-06-05 | 1988-12-13 | Akai Electric Co Ltd | 光ファイバの接続装置 |
| JPH0511528Y2 (US08080257-20111220-C00005.png) * | 1986-11-17 | 1993-03-23 |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56162854A (en) * | 1980-05-20 | 1981-12-15 | Nec Corp | Semiconductor integrated circuit device |
| JPS5745259A (en) * | 1980-09-01 | 1982-03-15 | Hitachi Ltd | Resin sealing type semiconductor device |
| JPS5756935A (en) * | 1980-09-22 | 1982-04-05 | Nec Corp | Semiconductor device |
| JPS5936945A (ja) * | 1982-08-24 | 1984-02-29 | Mitsubishi Electric Corp | 半導体装置の入力接続端子 |
| JPS61255039A (ja) * | 1985-05-07 | 1986-11-12 | Rohm Co Ltd | 半導体素子 |
| JPH0373438U (US08080257-20111220-C00005.png) * | 1989-11-21 | 1991-07-24 | ||
| KR100791281B1 (ko) | 1998-05-19 | 2008-01-04 | 이비덴 가부시키가이샤 | 프린트배선판 및 프린트배선판의 제조방법 |
| JP6040456B2 (ja) * | 2010-01-15 | 2016-12-07 | ローム株式会社 | 半導体装置およびその製造方法 |
| JP2018139290A (ja) * | 2018-03-28 | 2018-09-06 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
-
1977
- 1977-05-02 JP JP4995277A patent/JPS53135585A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0511528Y2 (US08080257-20111220-C00005.png) * | 1986-11-17 | 1993-03-23 | ||
| JPS63305309A (ja) * | 1987-06-05 | 1988-12-13 | Akai Electric Co Ltd | 光ファイバの接続装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53135585A (en) | 1978-11-27 |
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