JPS6151425B2 - - Google Patents
Info
- Publication number
- JPS6151425B2 JPS6151425B2 JP9852081A JP9852081A JPS6151425B2 JP S6151425 B2 JPS6151425 B2 JP S6151425B2 JP 9852081 A JP9852081 A JP 9852081A JP 9852081 A JP9852081 A JP 9852081A JP S6151425 B2 JPS6151425 B2 JP S6151425B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- circuit board
- rubber
- sealing
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 38
- 239000011347 resin Substances 0.000 claims description 38
- 239000004065 semiconductor Substances 0.000 claims description 20
- 238000001746 injection moulding Methods 0.000 claims description 2
- 238000001721 transfer moulding Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 description 12
- 239000007788 liquid Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 238000004382 potting Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9852081A JPS58159A (ja) | 1981-06-25 | 1981-06-25 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9852081A JPS58159A (ja) | 1981-06-25 | 1981-06-25 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58159A JPS58159A (ja) | 1983-01-05 |
| JPS6151425B2 true JPS6151425B2 (enrdf_load_stackoverflow) | 1986-11-08 |
Family
ID=14221926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9852081A Granted JPS58159A (ja) | 1981-06-25 | 1981-06-25 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58159A (enrdf_load_stackoverflow) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6150353A (ja) * | 1984-08-20 | 1986-03-12 | Oki Electric Ind Co Ltd | Ｅｐｒｏｍ装置 |
| DE3535365A1 (de) * | 1985-10-03 | 1987-04-09 | Gert Guenther Niggemeyer | Hochspannungs-kondensator-zuendgeraet fuer brennkraftmaschinen |
| NL9401682A (nl) * | 1994-10-12 | 1996-05-01 | Fico Bv | Werkwijze voor het omhullen van een chip en scheidingsstrip en matrijshelft te gebruiken met deze werkwijze. |
| FR2734948B1 (fr) * | 1995-05-31 | 1997-07-18 | Sgs Thomson Microelectronics | Boitier d'encapsulation a reseau de boules de soudure et procede d'encapsulation. |
| DE19729179C2 (de) * | 1997-01-08 | 2001-09-13 | Orient Semiconductor Elect Ltd | Verfahren und Vorrichtungen zum Vergießen einer Halbleiteranordnung mit Kunststoff |
| US5982625A (en) * | 1998-03-19 | 1999-11-09 | Advanced Semiconductor Engineering, Inc. | Semiconductor packaging device |
| US6372553B1 (en) * | 1998-05-18 | 2002-04-16 | St Assembly Test Services, Pte Ltd | Disposable mold runner gate for substrate based electronic packages |
| DE19935441A1 (de) * | 1999-07-28 | 2001-03-01 | Siemens Ag | Verfahren und Moldwerkzeug zum Umhüllen von elektronischen Bauelementen |
| US6398547B1 (en) * | 2000-03-31 | 2002-06-04 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Oxy-fuel combustion firing configurations and methods |
| KR100789951B1 (ko) * | 2006-06-09 | 2008-01-03 | 엘지전자 주식회사 | 발광 유닛 제작 장치 및 방법 |
-
1981
- 1981-06-25 JP JP9852081A patent/JPS58159A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58159A (ja) | 1983-01-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0482799A (ja) | Ｉｃカードの製造方法およびｉｃカード | |
| HK189495A (en) | Manufacturing process of a chip card and card obtained by this process | |
| JPS6151425B2 (enrdf_load_stackoverflow) | ||
| JPS624862B2 (enrdf_load_stackoverflow) | ||
| US6172424B1 (en) | Resin sealing type semiconductor device | |
| JPH08111132A (ja) | 照光式キートップ | |
| JP3572764B2 (ja) | ベアチップ封止方法およびベアチップ封止基板 | |
| JPH0195010A (ja) | 成形金型のクリーニング方法 | |
| JP3444747B2 (ja) | 電子部品の樹脂封止成形方法 | |
| JPS63216350A (ja) | 電子部品の樹脂封止法 | |
| JPH05144858A (ja) | 半導体の封止方法 | |
| JP2522304B2 (ja) | 半導体素子収納パッケ−ジの製造方法 | |
| KR910007471B1 (ko) | 회로기판과 그 제조방법 | |
| TWI646707B (zh) | 一種去除半導體塑封製程中所產生毛邊的方法 | |
| JPS6020142A (ja) | Ｉｓｆｅｔセンサ−の実装方法 | |
| JPS6214698Y2 (enrdf_load_stackoverflow) | ||
| JPH01239855A (ja) | 半導体装置のシーリング方法 | |
| JPH05335442A (ja) | 半導体装置の樹脂モールド方法 | |
| JPS572537A (en) | Semiconductor device | |
| JP2570157B2 (ja) | 樹脂封止用金型 | |
| JPS6332942A (ja) | 樹脂封止方法 | |
| JPH0546270Y2 (enrdf_load_stackoverflow) | ||
| JP3179947B2 (ja) | カウンター板へのシンクの取付方法 | |
| JPS6127182Y2 (enrdf_load_stackoverflow) | ||
| JPH05190763A (ja) | 封止部品 |