FR2734948B1 - Boitier d'encapsulation a reseau de boules de soudure et procede d'encapsulation. - Google Patents

Boitier d'encapsulation a reseau de boules de soudure et procede d'encapsulation.

Info

Publication number
FR2734948B1
FR2734948B1 FR9506497A FR9506497A FR2734948B1 FR 2734948 B1 FR2734948 B1 FR 2734948B1 FR 9506497 A FR9506497 A FR 9506497A FR 9506497 A FR9506497 A FR 9506497A FR 2734948 B1 FR2734948 B1 FR 2734948B1
Authority
FR
France
Prior art keywords
encapsulation
ball array
welding ball
box
encapsulation method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9506497A
Other languages
English (en)
Other versions
FR2734948A1 (fr
Inventor
Francois Lamourelle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
SGS Thomson Microelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SGS Thomson Microelectronics SA filed Critical SGS Thomson Microelectronics SA
Priority to FR9506497A priority Critical patent/FR2734948B1/fr
Priority to US08/654,819 priority patent/US6130383A/en
Publication of FR2734948A1 publication Critical patent/FR2734948A1/fr
Application granted granted Critical
Publication of FR2734948B1 publication Critical patent/FR2734948B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P80/00—Climate change mitigation technologies for sector-wide applications
    • Y02P80/30—Reducing waste in manufacturing processes; Calculations of released waste quantities

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
FR9506497A 1995-05-31 1995-05-31 Boitier d'encapsulation a reseau de boules de soudure et procede d'encapsulation. Expired - Fee Related FR2734948B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR9506497A FR2734948B1 (fr) 1995-05-31 1995-05-31 Boitier d'encapsulation a reseau de boules de soudure et procede d'encapsulation.
US08/654,819 US6130383A (en) 1995-05-31 1996-05-24 Solder ball array package and a method of encapsulation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9506497A FR2734948B1 (fr) 1995-05-31 1995-05-31 Boitier d'encapsulation a reseau de boules de soudure et procede d'encapsulation.

Publications (2)

Publication Number Publication Date
FR2734948A1 FR2734948A1 (fr) 1996-12-06
FR2734948B1 true FR2734948B1 (fr) 1997-07-18

Family

ID=9479568

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9506497A Expired - Fee Related FR2734948B1 (fr) 1995-05-31 1995-05-31 Boitier d'encapsulation a reseau de boules de soudure et procede d'encapsulation.

Country Status (1)

Country Link
FR (1) FR2734948B1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19729179C2 (de) * 1997-01-08 2001-09-13 Orient Semiconductor Elect Ltd Verfahren und Vorrichtungen zum Vergießen einer Halbleiteranordnung mit Kunststoff
FR2772987A1 (fr) * 1997-12-23 1999-06-25 Orient Semiconductor Elect Ltd Procede et appareil de moulage de puces a semi-conducteurs
US6372553B1 (en) * 1998-05-18 2002-04-16 St Assembly Test Services, Pte Ltd Disposable mold runner gate for substrate based electronic packages

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58159A (ja) * 1981-06-25 1983-01-05 Nec Corp 半導体装置
US4954308A (en) * 1988-03-04 1990-09-04 Citizen Watch Co., Ltd. Resin encapsulating method
JPH0724273B2 (ja) * 1988-11-09 1995-03-15 三菱電機株式会社 Ｉｃカード用のモジュールの製造方法
JP2706000B2 (ja) * 1990-11-13 1998-01-28 シチズン時計株式会社 樹脂封止型半導体装置
US5241133A (en) * 1990-12-21 1993-08-31 Motorola, Inc. Leadless pad array chip carrier
JP2970177B2 (ja) * 1992-02-24 1999-11-02 松下電器産業株式会社 プリント基板

Also Published As

Publication number Publication date
FR2734948A1 (fr) 1996-12-06

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20080131