JPS6150381B2 - - Google Patents

Info

Publication number
JPS6150381B2
JPS6150381B2 JP54027479A JP2747979A JPS6150381B2 JP S6150381 B2 JPS6150381 B2 JP S6150381B2 JP 54027479 A JP54027479 A JP 54027479A JP 2747979 A JP2747979 A JP 2747979A JP S6150381 B2 JPS6150381 B2 JP S6150381B2
Authority
JP
Japan
Prior art keywords
bonding
capillary
wire
chip
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54027479A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55120144A (en
Inventor
Kyoyuki Tada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP2747979A priority Critical patent/JPS55120144A/ja
Publication of JPS55120144A publication Critical patent/JPS55120144A/ja
Publication of JPS6150381B2 publication Critical patent/JPS6150381B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP2747979A 1979-03-08 1979-03-08 Automatic wire bonding system for semiconductor Granted JPS55120144A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2747979A JPS55120144A (en) 1979-03-08 1979-03-08 Automatic wire bonding system for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2747979A JPS55120144A (en) 1979-03-08 1979-03-08 Automatic wire bonding system for semiconductor

Publications (2)

Publication Number Publication Date
JPS55120144A JPS55120144A (en) 1980-09-16
JPS6150381B2 true JPS6150381B2 (enrdf_load_stackoverflow) 1986-11-04

Family

ID=12222251

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2747979A Granted JPS55120144A (en) 1979-03-08 1979-03-08 Automatic wire bonding system for semiconductor

Country Status (1)

Country Link
JP (1) JPS55120144A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3298795B2 (ja) * 1996-07-16 2002-07-08 株式会社新川 リードフレームの搬送データ設定方法
EP1625911B1 (de) * 2004-08-11 2007-10-10 F&K Delvotec Bondtechnik GmbH Drahtbonder mit einer Kamera, einer Bildverarbeitungseinrichtung, Speichermittel und Vergleichermittel und Verfahren zum Betrieb eines solchen

Also Published As

Publication number Publication date
JPS55120144A (en) 1980-09-16

Similar Documents

Publication Publication Date Title
US5294038A (en) Method of and apparatus for manufacturing semiconductor device
KR100199293B1 (ko) 반도체 패키지 제조 장치
KR940002761B1 (ko) 와이어 본딩 방법 및 장치
US7087457B2 (en) Die bonding method and apparatus
JPS6150381B2 (enrdf_load_stackoverflow)
KR100312743B1 (ko) 반도체 다이본다용 위치 인식과 검사장치 및 그 방법
JP4439598B2 (ja) フィルムキャリアテープの搬送装置
KR102098337B1 (ko) 반도체 패키지의 다중 클립 본딩 장치
JP2001250834A (ja) 半導体装置の製造方法
US20020181758A1 (en) Die bonding apparatus with automatic die and lead frame image matching system
JP2999298B2 (ja) 画像認識手段による電子部品の位置検出装置
US5137201A (en) Wire bonding method
JP2005144741A (ja) 樹脂封止装置及び樹脂封止方法
JPH04199666A (ja) 半導体装置のリードフォーミング装置
JPH0582741B2 (enrdf_load_stackoverflow)
JP2013197226A (ja) ダイボンディング方法及びダイボンダ
JP2979743B2 (ja) 光結合器の生産システム
JPS59139639A (ja) 半導体製造装置
JP3169046B2 (ja) チップの認識方法及びその認識装置
CN120319683A (zh) 半导体制造装置、半导体器件的制造方法及拾取方法
JP2002237560A (ja) 電子部品のリード電極切断装置
JP2966045B2 (ja) 加工装置のための動作量補正方法及び装置
KR101138703B1 (ko) 본딩설비의 자재 투입장치 및 이를 이용한 자재 투입방법
JPH04324948A (ja) ボンディング方法
KR20240104871A (ko) 다이 이젝트 장치 및 다이 이젝트 방법