JPS6335098B2 - - Google Patents

Info

Publication number
JPS6335098B2
JPS6335098B2 JP55005695A JP569580A JPS6335098B2 JP S6335098 B2 JPS6335098 B2 JP S6335098B2 JP 55005695 A JP55005695 A JP 55005695A JP 569580 A JP569580 A JP 569580A JP S6335098 B2 JPS6335098 B2 JP S6335098B2
Authority
JP
Japan
Prior art keywords
pellet
wire
substrate
pellets
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55005695A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56103434A (en
Inventor
Juzo Taniguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP569580A priority Critical patent/JPS56103434A/ja
Publication of JPS56103434A publication Critical patent/JPS56103434A/ja
Publication of JPS6335098B2 publication Critical patent/JPS6335098B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP569580A 1980-01-23 1980-01-23 Automatic wire bonding Granted JPS56103434A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP569580A JPS56103434A (en) 1980-01-23 1980-01-23 Automatic wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP569580A JPS56103434A (en) 1980-01-23 1980-01-23 Automatic wire bonding

Publications (2)

Publication Number Publication Date
JPS56103434A JPS56103434A (en) 1981-08-18
JPS6335098B2 true JPS6335098B2 (enrdf_load_stackoverflow) 1988-07-13

Family

ID=11618230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP569580A Granted JPS56103434A (en) 1980-01-23 1980-01-23 Automatic wire bonding

Country Status (1)

Country Link
JP (1) JPS56103434A (enrdf_load_stackoverflow)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50150368A (enrdf_load_stackoverflow) * 1974-05-22 1975-12-02
JPS52137983A (en) * 1976-05-14 1977-11-17 Shinkawa Seisakusho Kk Mounting method of semiconductor tip by tapeecarrier system
JPS538061A (en) * 1976-07-09 1978-01-25 Mitsubishi Electric Corp Automatic positioning apparatus of articles
JPS5483769A (en) * 1977-12-17 1979-07-04 Toshiba Corp Bonding device

Also Published As

Publication number Publication date
JPS56103434A (en) 1981-08-18

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