JPS6150157B2 - - Google Patents
Info
- Publication number
- JPS6150157B2 JPS6150157B2 JP19608881A JP19608881A JPS6150157B2 JP S6150157 B2 JPS6150157 B2 JP S6150157B2 JP 19608881 A JP19608881 A JP 19608881A JP 19608881 A JP19608881 A JP 19608881A JP S6150157 B2 JPS6150157 B2 JP S6150157B2
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- plating
- plating film
- mold
- electroforming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 47
- 239000002131 composite material Substances 0.000 claims description 14
- 239000011159 matrix material Substances 0.000 claims description 10
- 238000005323 electroforming Methods 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 2
- 229910052755 nonmetal Inorganic materials 0.000 claims 1
- 238000003672 processing method Methods 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 26
- 229910052759 nickel Inorganic materials 0.000 description 13
- 239000004809 Teflon Substances 0.000 description 11
- 229920006362 Teflon® Polymers 0.000 description 11
- 239000002245 particle Substances 0.000 description 11
- 238000000071 blow moulding Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001295 No alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010907 mechanical stirring Methods 0.000 description 1
- 239000011505 plaster Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19608881A JPS5896889A (ja) | 1981-12-04 | 1981-12-04 | 電鋳加工による成形型の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19608881A JPS5896889A (ja) | 1981-12-04 | 1981-12-04 | 電鋳加工による成形型の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5896889A JPS5896889A (ja) | 1983-06-09 |
| JPS6150157B2 true JPS6150157B2 (enEXAMPLES) | 1986-11-01 |
Family
ID=16352003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19608881A Granted JPS5896889A (ja) | 1981-12-04 | 1981-12-04 | 電鋳加工による成形型の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5896889A (enEXAMPLES) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02175893A (ja) * | 1988-12-27 | 1990-07-09 | Konan Tokushu Sangyo Kk | 微細凹凸模様付き電鋳金型の製造方法 |
| WO2008133864A2 (en) * | 2007-04-23 | 2008-11-06 | Tessera North America, Inc. | Mass production of micro-optical devices, corresponding tools, and resultant structures |
| TW201219187A (en) * | 2010-11-09 | 2012-05-16 | jun-jie Zheng | uses a pretreatment work on a first mold to form a forming layer and obtains a metal plated film containing a conductive material through an electroforming process |
-
1981
- 1981-12-04 JP JP19608881A patent/JPS5896889A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5896889A (ja) | 1983-06-09 |
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