JPS61501154A - エポキシ樹脂組成物およびそれからラミネ−トを製造する方法 - Google Patents

エポキシ樹脂組成物およびそれからラミネ−トを製造する方法

Info

Publication number
JPS61501154A
JPS61501154A JP60500642A JP50064285A JPS61501154A JP S61501154 A JPS61501154 A JP S61501154A JP 60500642 A JP60500642 A JP 60500642A JP 50064285 A JP50064285 A JP 50064285A JP S61501154 A JPS61501154 A JP S61501154A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
phenol
curing agent
composition according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60500642A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0369364B2 (cg-RX-API-DMAC7.html
Inventor
ケーニヒ，レイモンド
クライン，デイーター・ハー
ウルシユラー，ロベルト
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Chemical Co
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of JPS61501154A publication Critical patent/JPS61501154A/ja
Publication of JPH0369364B2 publication Critical patent/JPH0369364B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
    • C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
    • C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
    • C08G14/06—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen
    • C08G14/10—Melamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C08G59/623—Aminophenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Processing Of Terminals (AREA)
  • Manufacturing Of Electric Cables (AREA)
JP60500642A 1984-01-31 1985-01-30 エポキシ樹脂組成物およびそれからラミネ−トを製造する方法 Granted JPS61501154A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3403172 1984-01-31
DE3403172.3 1984-01-31

Publications (2)

Publication Number Publication Date
JPS61501154A true JPS61501154A (ja) 1986-06-12
JPH0369364B2 JPH0369364B2 (cg-RX-API-DMAC7.html) 1991-10-31

Family

ID=6226300

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60500642A Granted JPS61501154A (ja) 1984-01-31 1985-01-30 エポキシ樹脂組成物およびそれからラミネ−トを製造する方法

Country Status (18)

Country Link
US (1) US4661568A (cg-RX-API-DMAC7.html)
EP (2) EP0155469B1 (cg-RX-API-DMAC7.html)
JP (1) JPS61501154A (cg-RX-API-DMAC7.html)
KR (2) KR920002615B1 (cg-RX-API-DMAC7.html)
AT (1) ATE35817T1 (cg-RX-API-DMAC7.html)
AU (1) AU557131B2 (cg-RX-API-DMAC7.html)
BR (1) BR8505172A (cg-RX-API-DMAC7.html)
CA (1) CA1276358C (cg-RX-API-DMAC7.html)
DE (1) DE3563852D1 (cg-RX-API-DMAC7.html)
DK (1) DK440085A (cg-RX-API-DMAC7.html)
ES (1) ES8608020A1 (cg-RX-API-DMAC7.html)
FI (1) FI853743A7 (cg-RX-API-DMAC7.html)
IE (1) IE57890B1 (cg-RX-API-DMAC7.html)
IL (1) IL74199A (cg-RX-API-DMAC7.html)
IN (1) IN164123B (cg-RX-API-DMAC7.html)
NO (1) NO161266C (cg-RX-API-DMAC7.html)
SG (1) SG87488G (cg-RX-API-DMAC7.html)
WO (1) WO1985003515A1 (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996028490A1 (en) * 1995-03-14 1996-09-19 Nissan Chemical Industries, Ltd. Heat-resistant epoxy resin composition

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8519290D0 (en) * 1985-07-31 1985-09-04 Dow Chemical Rheinwerk Gmbh Resin composition
IL80277A0 (en) * 1985-10-15 1987-01-30 President Eng Corp Process for the production of prepregs and metal-laminated base material for circuit boards,and apparatus for carrying out this process
US4808652A (en) * 1988-06-08 1989-02-28 Monsanto Company Crosslinker compositions comprising amino resins, epoxies and styrene allyl alcohol copolymers
US5210157A (en) * 1989-08-15 1993-05-11 Akzo N.V. Interpenetrating network of ring-containing allyl polymers and epoxy resin, and a laminate prepared therefrom
EP0507271A3 (en) * 1991-04-03 1993-04-21 The Dow Chemical Company Epoxy resin compositions for use in electrical laminates
US5364925A (en) * 1992-01-27 1994-11-15 The Dow Chemical Company Epoxy resin advanced with a dihydric phenol and further chain extended with an additional dihydric phenol for use in electrical laminates
CA2199390A1 (en) * 1994-09-08 1996-03-14 Jan Andre Jozef Schutyser Allyl-containing epoxy resin composition comprising a copolymer of an ethylenically unsaturated anhydride and a vinyl compound
CA2270208C (en) 1996-10-29 2004-09-14 Akzo Nobel Nv Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross-linking agent
JPH11279376A (ja) * 1998-03-27 1999-10-12 Hitachi Chem Co Ltd 印刷配線板用エポキシ樹脂組成物およびこれを用いた印刷配線板
US6855738B2 (en) 2003-06-06 2005-02-15 Dow Global Technologies Inc. Nanoporous laminates
CN103119079A (zh) * 2010-09-29 2013-05-22 日本电石工业株式会社 三聚氰胺环氧树脂单体及树脂组合物
WO2014059424A2 (en) 2012-10-12 2014-04-17 High Voltage Graphics, Inc. Flexible heat sealable decorative articles and method for making the same
CN104755532B (zh) 2012-10-31 2017-05-03 英派尔科技开发有限公司 多官能三聚氰胺环氧树脂、羟甲基和胺
US9890130B2 (en) 2013-02-15 2018-02-13 Empire Technology Development Llc Phenolic epoxy compounds
KR101806862B1 (ko) 2013-06-13 2017-12-08 엠파이어 테크놀로지 디벨롭먼트 엘엘씨 다작용 페놀 수지
WO2015084304A1 (en) 2013-12-02 2015-06-11 Empire Technology Development Llc Novel gemini surfactants and their use
US9526185B2 (en) * 2014-04-08 2016-12-20 Finisar Corporation Hybrid PCB with multi-unreinforced laminate
WO2016134937A1 (en) 2015-02-27 2016-09-01 Huntsman Advanced Materials (Switzerland) Gmbh A process for manufacturing a fiber reinforced composite article, the composite article obtained and the use thereof
WO2022174876A1 (en) * 2021-02-16 2022-08-25 Vestas Wind Systems A/S Improvements relating to the manufacture of a wind turbine component
CA3256979A1 (en) * 2022-05-20 2023-11-23 Epoxy Technology, Inc. HIGH-PERFORMANCE COMPLIANT COATINGS

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5913768A (ja) * 1982-06-30 1984-01-24 シエル・インタ−ナシヨネイル・リサ−チ・マ−チヤツピイ・ベ−・ウイ アミノトリアジン誘導体、それらの製造およびそれらの熱硬化性組成物中への使用

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB622675A (en) * 1946-10-02 1949-05-05 Donald Atherton Manufacture of new synthetic resinous condensation products
US3502557A (en) * 1965-04-01 1970-03-24 Ppg Industries Inc Electrodeposition of amine-aldehyde condensate and hydroxy-containing carboxylic acid coreaction products
US4499268A (en) * 1982-02-23 1985-02-12 Ciba Geigy Corporation Process for the preparation of isomelamines
US4467070A (en) * 1982-09-30 1984-08-21 Ford Motor Company Thermosetting coating composition comprising polymeric catalyst - III

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5913768A (ja) * 1982-06-30 1984-01-24 シエル・インタ−ナシヨネイル・リサ−チ・マ−チヤツピイ・ベ−・ウイ アミノトリアジン誘導体、それらの製造およびそれらの熱硬化性組成物中への使用

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996028490A1 (en) * 1995-03-14 1996-09-19 Nissan Chemical Industries, Ltd. Heat-resistant epoxy resin composition

Also Published As

Publication number Publication date
DK440085D0 (da) 1985-09-27
IL74199A0 (en) 1985-04-30
AU557131B2 (en) 1986-12-04
IE57890B1 (en) 1993-05-05
EP0169865A1 (en) 1986-02-05
US4661568A (en) 1987-04-28
NO853822L (no) 1985-09-27
SG87488G (en) 1989-06-16
AU3934285A (en) 1985-08-27
EP0155469B1 (en) 1988-07-20
ATE35817T1 (de) 1988-08-15
KR850700252A (ko) 1985-12-26
NO161266C (no) 1989-07-26
FI853743L (fi) 1985-09-27
IN164123B (cg-RX-API-DMAC7.html) 1989-01-14
FI853743A0 (fi) 1985-09-27
IE850224L (en) 1985-07-31
NO161266B (no) 1989-04-17
JPH0369364B2 (cg-RX-API-DMAC7.html) 1991-10-31
BR8505172A (pt) 1986-01-21
CA1276358C (en) 1990-11-13
DE3563852D1 (en) 1988-08-25
KR920002615B1 (ko) 1992-03-30
WO1985003515A1 (en) 1985-08-15
FI853743A7 (fi) 1985-09-27
IL74199A (en) 1988-07-31
ES8608020A1 (es) 1986-04-16
ES539962A0 (es) 1986-04-16
EP0155469A1 (en) 1985-09-25
DK440085A (da) 1985-09-27

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