DK440085A - Epoxyharpiksmateriale og fremgangsmaade til fremstilling af laminater deraf - Google Patents
Epoxyharpiksmateriale og fremgangsmaade til fremstilling af laminater deraf Download PDFInfo
- Publication number
- DK440085A DK440085A DK440085A DK440085A DK440085A DK 440085 A DK440085 A DK 440085A DK 440085 A DK440085 A DK 440085A DK 440085 A DK440085 A DK 440085A DK 440085 A DK440085 A DK 440085A
- Authority
- DK
- Denmark
- Prior art keywords
- epoxy resin
- laminates
- procedures
- production
- resin materials
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
- C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
- C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
- C08G14/06—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen
- C08G14/10—Melamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
- C08G59/623—Aminophenols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Processing Of Terminals (AREA)
- Manufacturing Of Electric Cables (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3403172 | 1984-01-31 | ||
PCT/EP1985/000026 WO1985003515A1 (en) | 1984-01-31 | 1985-01-30 | Epoxy resin composition and process for preparing laminates therefrom |
Publications (2)
Publication Number | Publication Date |
---|---|
DK440085A true DK440085A (da) | 1985-09-27 |
DK440085D0 DK440085D0 (da) | 1985-09-27 |
Family
ID=6226300
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK440085A DK440085D0 (da) | 1984-01-31 | 1985-09-27 | Epoxyharpiksmateriale og fremgangsmaade til fremstilling af laminater deraf |
Country Status (18)
Country | Link |
---|---|
US (1) | US4661568A (da) |
EP (2) | EP0169865A1 (da) |
JP (1) | JPS61501154A (da) |
KR (2) | KR920002615B1 (da) |
AT (1) | ATE35817T1 (da) |
AU (1) | AU557131B2 (da) |
BR (1) | BR8505172A (da) |
CA (1) | CA1276358C (da) |
DE (1) | DE3563852D1 (da) |
DK (1) | DK440085D0 (da) |
ES (1) | ES8608020A1 (da) |
FI (1) | FI853743A0 (da) |
IE (1) | IE57890B1 (da) |
IL (1) | IL74199A (da) |
IN (1) | IN164123B (da) |
NO (1) | NO161266C (da) |
SG (1) | SG87488G (da) |
WO (1) | WO1985003515A1 (da) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8519290D0 (en) * | 1985-07-31 | 1985-09-04 | Dow Chemical Rheinwerk Gmbh | Resin composition |
IL80277A0 (en) * | 1985-10-15 | 1987-01-30 | President Eng Corp | Process for the production of prepregs and metal-laminated base material for circuit boards,and apparatus for carrying out this process |
US4808652A (en) * | 1988-06-08 | 1989-02-28 | Monsanto Company | Crosslinker compositions comprising amino resins, epoxies and styrene allyl alcohol copolymers |
US5210157A (en) * | 1989-08-15 | 1993-05-11 | Akzo N.V. | Interpenetrating network of ring-containing allyl polymers and epoxy resin, and a laminate prepared therefrom |
MY131084A (en) * | 1991-04-03 | 2007-07-31 | Dow Chemical Co | Epoxy resin compositions for use in electrical laminates. |
US5364925A (en) * | 1992-01-27 | 1994-11-15 | The Dow Chemical Company | Epoxy resin advanced with a dihydric phenol and further chain extended with an additional dihydric phenol for use in electrical laminates |
JPH10505376A (ja) * | 1994-09-08 | 1998-05-26 | アクゾ ノーベル ナムローゼ フェンノートシャップ | エチレン性不飽和無水物とビニル化合物との共重合体を含む、アリルを含むエポキシ樹脂組成物 |
AU4953496A (en) * | 1995-03-14 | 1996-10-02 | Nissan Chemical Industries Ltd. | Heat-resistant epoxy resin composition |
ATE210161T1 (de) | 1996-10-29 | 2001-12-15 | Isola Laminate Systems Corp | Copolymer aus styrol und maleinsäureanhydrid enthaltende epoxidharzzusammensetzung und covernetzer |
JPH11279376A (ja) * | 1998-03-27 | 1999-10-12 | Hitachi Chem Co Ltd | 印刷配線板用エポキシ樹脂組成物およびこれを用いた印刷配線板 |
US6855738B2 (en) | 2003-06-06 | 2005-02-15 | Dow Global Technologies Inc. | Nanoporous laminates |
CN103119079A (zh) * | 2010-09-29 | 2013-05-22 | 日本电石工业株式会社 | 三聚氰胺环氧树脂单体及树脂组合物 |
US9193214B2 (en) | 2012-10-12 | 2015-11-24 | High Voltage Graphics, Inc. | Flexible heat sealable decorative articles and method for making the same |
WO2014070155A1 (en) * | 2012-10-31 | 2014-05-08 | Empire Technology Development Llc | Multifunctional melamine epoxy resins, methylols and amines |
US9890130B2 (en) | 2013-02-15 | 2018-02-13 | Empire Technology Development Llc | Phenolic epoxy compounds |
EP3008125A4 (en) | 2013-06-13 | 2016-12-07 | Empire Technology Dev Llc | MULTIFUNCTIONAL PHENOLIN RESINS |
CN105814014B (zh) | 2013-12-02 | 2018-06-12 | 英派尔科技开发有限公司 | 新型双子表面活性剂和它们的用途 |
US9526185B2 (en) * | 2014-04-08 | 2016-12-20 | Finisar Corporation | Hybrid PCB with multi-unreinforced laminate |
CN107530985B (zh) | 2015-02-27 | 2020-06-19 | 亨斯迈先进材料特许(瑞士)有限公司 | 纤维增强的复合制品的制备方法、所得复合制品及其用途 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB622675A (en) * | 1946-10-02 | 1949-05-05 | Donald Atherton | Manufacture of new synthetic resinous condensation products |
US3502557A (en) * | 1965-04-01 | 1970-03-24 | Ppg Industries Inc | Electrodeposition of amine-aldehyde condensate and hydroxy-containing carboxylic acid coreaction products |
US4499268A (en) * | 1982-02-23 | 1985-02-12 | Ciba Geigy Corporation | Process for the preparation of isomelamines |
US4467070A (en) * | 1982-09-30 | 1984-08-21 | Ford Motor Company | Thermosetting coating composition comprising polymeric catalyst - III |
US4393181A (en) * | 1982-06-30 | 1983-07-12 | Shell Oil Company | Polyfunctional phenolic-melamine epoxy resin curing agents |
-
1985
- 1985-01-29 CA CA000473035A patent/CA1276358C/en not_active Expired - Fee Related
- 1985-01-30 EP EP85900668A patent/EP0169865A1/en active Pending
- 1985-01-30 IL IL74199A patent/IL74199A/xx unknown
- 1985-01-30 DE DE8585100914T patent/DE3563852D1/de not_active Expired
- 1985-01-30 AT AT85100914T patent/ATE35817T1/de not_active IP Right Cessation
- 1985-01-30 BR BR8505172A patent/BR8505172A/pt not_active IP Right Cessation
- 1985-01-30 JP JP60500642A patent/JPS61501154A/ja active Granted
- 1985-01-30 EP EP85100914A patent/EP0155469B1/en not_active Expired
- 1985-01-30 IE IE224/85A patent/IE57890B1/en not_active IP Right Cessation
- 1985-01-30 KR KR1019850700238A patent/KR920002615B1/ko active
- 1985-01-30 WO PCT/EP1985/000026 patent/WO1985003515A1/en not_active Application Discontinuation
- 1985-01-30 AU AU39342/85A patent/AU557131B2/en not_active Ceased
- 1985-01-30 US US06/776,558 patent/US4661568A/en not_active Expired - Fee Related
- 1985-01-30 ES ES539962A patent/ES8608020A1/es not_active Expired
- 1985-01-31 IN IN87/MAS/85A patent/IN164123B/en unknown
- 1985-09-27 FI FI853743A patent/FI853743A0/fi not_active Application Discontinuation
- 1985-09-27 NO NO85853822A patent/NO161266C/no unknown
- 1985-09-27 DK DK440085A patent/DK440085D0/da not_active Application Discontinuation
- 1985-09-28 KR KR1019850700238A patent/KR850700252A/ko not_active IP Right Cessation
-
1988
- 1988-12-14 SG SG874/88A patent/SG87488G/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP0169865A1 (en) | 1986-02-05 |
BR8505172A (pt) | 1986-01-21 |
SG87488G (en) | 1989-06-16 |
JPH0369364B2 (da) | 1991-10-31 |
IL74199A0 (en) | 1985-04-30 |
WO1985003515A1 (en) | 1985-08-15 |
NO161266B (no) | 1989-04-17 |
IE57890B1 (en) | 1993-05-05 |
FI853743L (fi) | 1985-09-27 |
FI853743A0 (fi) | 1985-09-27 |
ES539962A0 (es) | 1986-04-16 |
KR850700252A (ko) | 1985-12-26 |
ES8608020A1 (es) | 1986-04-16 |
EP0155469B1 (en) | 1988-07-20 |
IN164123B (da) | 1989-01-14 |
IE850224L (en) | 1985-07-31 |
EP0155469A1 (en) | 1985-09-25 |
JPS61501154A (ja) | 1986-06-12 |
CA1276358C (en) | 1990-11-13 |
US4661568A (en) | 1987-04-28 |
AU3934285A (en) | 1985-08-27 |
KR920002615B1 (ko) | 1992-03-30 |
DK440085D0 (da) | 1985-09-27 |
ATE35817T1 (de) | 1988-08-15 |
NO853822L (no) | 1985-09-27 |
IL74199A (en) | 1988-07-31 |
DE3563852D1 (en) | 1988-08-25 |
AU557131B2 (en) | 1986-12-04 |
NO161266C (no) | 1989-07-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DK440085A (da) | Epoxyharpiksmateriale og fremgangsmaade til fremstilling af laminater deraf | |
MY102533A (en) | Resin composition and a process for preparing laminates therefrom. | |
EP0911326A4 (en) | DIGLYCIDYLETHER | |
ES492685A0 (es) | Procedimiento para la preparacion de mezclas de pura contraccion que se endurecen por acidos, para masillas. | |
DK0650504T3 (da) | Fremgangsmåde tilfremstilling af en flammeresistent epoxidharpiksformasse | |
DK310689D0 (da) | Monocarboxylsyrederivater af aromatisk baserede epoxyharpikser | |
ES539774A0 (es) | Procedimiento para preparar una mezcla endurecible por aci- dos para masillas pobres en contraccion | |
JPS564610A (en) | Curable resin composition | |
JPS64116A (en) | Curable epoxy resin composition | |
JPS57187325A (en) | Production of epoxy resin laminated sheet | |
JPS56108792A (en) | 1-alkyl-4-hydroxymethyl-2,6,7-trioxabicyclo 2,2,2 octane | |
JPS57155226A (en) | Preparation of modified epoxy resin | |
JPS5599912A (en) | Curable resin composition | |
JPS5565254A (en) | Flame-retardant curable resin composition | |
JPS56141316A (en) | Epoxy resin composition | |
JPS54154494A (en) | Preparation of thermosetting resin | |
JPS55129411A (en) | Preparation of plasticized modified phenolic resin | |
JPS54129095A (en) | Thermosetting resin composition | |
EP0491045A4 (en) | Novel phenol/aralkyl resin, production thereof, and epoxy resin composition containing the same | |
JPS5531805A (en) | Epoxy resin composition |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AHB | Application shelved due to non-payment |