DK0650504T3 - Fremgangsmåde tilfremstilling af en flammeresistent epoxidharpiksformasse - Google Patents

Fremgangsmåde tilfremstilling af en flammeresistent epoxidharpiksformasse

Info

Publication number
DK0650504T3
DK0650504T3 DK93912646T DK93912646T DK0650504T3 DK 0650504 T3 DK0650504 T3 DK 0650504T3 DK 93912646 T DK93912646 T DK 93912646T DK 93912646 T DK93912646 T DK 93912646T DK 0650504 T3 DK0650504 T3 DK 0650504T3
Authority
DK
Denmark
Prior art keywords
resin
epoxy
mixture
groups
resin mixture
Prior art date
Application number
DK93912646T
Other languages
English (en)
Inventor
Peter Donner
Michael Schreyer
Helmut Markert
Klaus Kretzschmar
Ller Klaus M
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of DK0650504T3 publication Critical patent/DK0650504T3/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/16—Catalysts
    • C08G18/18—Catalysts containing secondary or tertiary amines or salts thereof
    • C08G18/20—Heterocyclic amines; Salts thereof
    • C08G18/2009—Heterocyclic amines; Salts thereof containing one heterocyclic ring
    • C08G18/2027—Heterocyclic amines; Salts thereof containing one heterocyclic ring having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/58—Epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4028—Isocyanates; Thioisocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
DK93912646T 1992-07-17 1993-07-02 Fremgangsmåde tilfremstilling af en flammeresistent epoxidharpiksformasse DK0650504T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4223632A DE4223632A1 (de) 1992-07-17 1992-07-17 Verfahren zur Herstellung einer flammwidrig eingestellten Epoxidharzformmasse
PCT/DE1993/000584 WO1994002528A1 (de) 1992-07-17 1993-07-02 Verfahren zur herstellung einer flammwidrig eingestellten epoxidharzformmasse

Publications (1)

Publication Number Publication Date
DK0650504T3 true DK0650504T3 (da) 1998-07-27

Family

ID=6463505

Family Applications (1)

Application Number Title Priority Date Filing Date
DK93912646T DK0650504T3 (da) 1992-07-17 1993-07-02 Fremgangsmåde tilfremstilling af en flammeresistent epoxidharpiksformasse

Country Status (10)

Country Link
US (1) US6225377B1 (da)
EP (1) EP0650504B1 (da)
JP (1) JP3267297B2 (da)
KR (1) KR100243569B1 (da)
AT (1) ATE160154T1 (da)
DE (2) DE4223632A1 (da)
DK (1) DK0650504T3 (da)
ES (1) ES2108873T3 (da)
MY (1) MY113697A (da)
WO (1) WO1994002528A1 (da)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0828774B1 (de) * 1995-05-24 1999-08-11 Siemens Aktiengesellschaft Epoxidharzformmassen mit halogenfreiem flammschutz
US6410615B1 (en) 1998-06-09 2002-06-25 Nitto Denko Corporation Semiconductor sealing epoxy resin composition and semiconductor device using the same
KR100573230B1 (ko) * 1999-06-15 2006-04-24 스미또모 베이크라이트 가부시키가이샤 반도체 봉지용 에폭시 수지 성형 재료의 제조 방법, 이의성형 재료 및 이의 반도체 장치
JP4568936B2 (ja) * 2000-01-17 2010-10-27 住友ベークライト株式会社 難燃性樹脂組成物、これを用いたプリプレグ及び積層板
US7192997B2 (en) 2001-02-07 2007-03-20 International Business Machines Corporation Encapsulant composition and electronic package utilizing same
US20130224496A1 (en) * 2010-10-29 2013-08-29 Hardcoat Surfaces Llc High Hardness Low Surface Energy Coating
JP6060262B2 (ja) * 2013-07-31 2017-01-11 ミネベア株式会社 熱硬化性樹脂組成物及び摺動部材、並びに摺動部材の製造方法
RU2559442C2 (ru) * 2013-09-23 2015-08-10 Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг России) Состав эпоксиполиуретанового компаунда и способ его получения
US20150179477A1 (en) * 2013-12-23 2015-06-25 Stmicroelectronics, Inc. Packaged ic devices and associated ic device packaging methods
DE102020127830A1 (de) * 2020-10-22 2022-04-28 Infineon Technologies Ag Moldverbindungen und Packages zum Verkapseln elektronischer Komponenten

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3028251A (en) 1956-11-20 1962-04-03 Polymer Corp Method of coating an article with a powdered resin composition and method of making the composition
US3334110A (en) * 1965-08-16 1967-08-01 Baker Chem Co J T Method for preparing epoxyoxazolidinones
JPS5315757B2 (da) * 1973-08-31 1978-05-26
JPS5331197B2 (da) 1973-09-26 1978-08-31
JPS51128400A (en) 1975-04-30 1976-11-09 Hitachi Ltd Thermosetting resin molding compounds
US4401499A (en) * 1980-06-09 1983-08-30 Sumitomo Bakelite Company Limited Crosslinked resin of epoxy compound and isocyanate and process for producing same
ZA839459B (en) 1982-12-30 1985-08-28 Mobil Oil Corp Polyoxazolidone powder coating compositions
DE3323123A1 (de) * 1983-06-27 1985-01-10 Siemens AG, 1000 Berlin und 8000 München Hitzehaertbare reaktionsharzmischungen
DE3323122A1 (de) 1983-06-27 1985-05-23 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von reaktionsharzformstoffen
DE3323154A1 (de) * 1983-06-27 1985-01-03 Siemens AG, 1000 Berlin und 8000 München Verfahren zur impraegnierung und einbettung von elektrischen wicklungen
DE3323084A1 (de) 1983-06-27 1985-01-10 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von formstoffen
GB8412900D0 (en) * 1984-05-21 1984-06-27 Secr Defence Thermosetting resin compositions
JPS61181820A (ja) 1985-02-06 1986-08-14 Sumitomo Bakelite Co Ltd 熱硬化性樹脂組成物
US4658007A (en) * 1985-05-07 1987-04-14 The Dow Chemical Company Polyisocyanurate-based polyoxazolidone polymers and process for their preparation
DE3720759A1 (de) 1987-06-24 1989-01-05 Bayer Ag Oxazolidongruppen enthaltende epoxidharze
US4906722A (en) * 1987-12-02 1990-03-06 Ciba-Geigy Corporation Thermosetting reactive systems
GB8912952D0 (en) 1989-06-06 1989-07-26 Dow Rheinmuenster Epoxy-terminated polyoxazolidones,process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones
FI902943A7 (fi) * 1989-07-19 1991-01-20 Siemens Ag Kuumassa kovettuvia reaktiohartsiseoksia

Also Published As

Publication number Publication date
ES2108873T3 (es) 1998-01-01
DE4223632A1 (de) 1994-01-20
EP0650504A1 (de) 1995-05-03
KR950702590A (ko) 1995-07-29
JP3267297B2 (ja) 2002-03-18
EP0650504B1 (de) 1997-11-12
MY113697A (en) 2002-05-31
US6225377B1 (en) 2001-05-01
WO1994002528A1 (de) 1994-02-03
DE59307683D1 (de) 1997-12-18
ATE160154T1 (de) 1997-11-15
KR100243569B1 (ko) 2000-02-01
JPH07509022A (ja) 1995-10-05

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