ES2108873T3 - Procedimiento para la obtencion de una masa moldeada de resina epoxi sometida a ignifugacion. - Google Patents
Procedimiento para la obtencion de una masa moldeada de resina epoxi sometida a ignifugacion.Info
- Publication number
- ES2108873T3 ES2108873T3 ES93912646T ES93912646T ES2108873T3 ES 2108873 T3 ES2108873 T3 ES 2108873T3 ES 93912646 T ES93912646 T ES 93912646T ES 93912646 T ES93912646 T ES 93912646T ES 2108873 T3 ES2108873 T3 ES 2108873T3
- Authority
- ES
- Spain
- Prior art keywords
- resin
- epoxy
- epoxy resin
- mixture
- groups
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/16—Catalysts
- C08G18/18—Catalysts containing secondary or tertiary amines or salts thereof
- C08G18/20—Heterocyclic amines; Salts thereof
- C08G18/2009—Heterocyclic amines; Salts thereof containing one heterocyclic ring
- C08G18/2027—Heterocyclic amines; Salts thereof containing one heterocyclic ring having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/58—Epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4028—Isocyanates; Thioisocyanates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyurethanes Or Polyureas (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
EN UN PROCEDIMIENTO PARA LA ELABORACION DE UNA MASA DE MOLDEO DE RESINA EPOXI ENDURECIBLE FENOLICAMENTE, CON CAPACIDAD LATENTE REACTIVA, CON CAPACIDAD DE FLUIR, AJUSTADA DE FORMA RESISTENTE A LA LLAMA, PARA REVESTIMIENTO DE ELEMENTOS COMPONENTES DE ELECTRONICA SE TRANSFORMA UNA MEZCLA DE RESINA DE REACCION POLIMERIZABLE TERMICAMENTE, CONTENIENDO MATERIAL DE RELLENO, DE RESINAS POLIEPOXI, COMPUESTA DE UNA MEZCLA A PARTIR DE RESINAS EPOXI DIFUNCIONALES Y MULTIFUNCIONALES, Y RESINAS POLIISOCIANATO CON UNA RELACION MOLAR DE LOS GRUPOS EPOXI A LOS GRUPOS ISOCIANATO MAYOR DE 1 -BAJO UTILIZACION DE IMIDAZOL SUSTITUIDO COMO ACELERADOR DE REACCION EN UNA CONCENTRACION DESDE 0,5 HASTA 2,5 %, CON REFERENCIA A LA RESINA POLIEPOXI ATURA HASTA 200 RESINA EPOXI PREPOLIMERA REACTIVA DE FORMA LATENTE, LIBRE DE GRUPOS ISOCIANATO Y LA MEZCLA DE RESINA EPOXI PREPOLIMERA SE MEZCLA CON UNA MEZCLA DE RESINA FENOL PULVERIFORME, CONTENIENDO MATERIAL DE RELLENO EN UNA RELACION MOLAR DE LOS GRUPOS EPOXI A LOS GRUPOSHIDROXIL FENOLICOS DESDE 1:0,4 HASTA 1:1,1, EVENTUALMENTE BAJO ADICION DE ADITIVOS.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4223632A DE4223632A1 (de) | 1992-07-17 | 1992-07-17 | Verfahren zur Herstellung einer flammwidrig eingestellten Epoxidharzformmasse |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2108873T3 true ES2108873T3 (es) | 1998-01-01 |
Family
ID=6463505
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES93912646T Expired - Lifetime ES2108873T3 (es) | 1992-07-17 | 1993-07-02 | Procedimiento para la obtencion de una masa moldeada de resina epoxi sometida a ignifugacion. |
Country Status (10)
Country | Link |
---|---|
US (1) | US6225377B1 (es) |
EP (1) | EP0650504B1 (es) |
JP (1) | JP3267297B2 (es) |
KR (1) | KR100243569B1 (es) |
AT (1) | ATE160154T1 (es) |
DE (2) | DE4223632A1 (es) |
DK (1) | DK0650504T3 (es) |
ES (1) | ES2108873T3 (es) |
MY (1) | MY113697A (es) |
WO (1) | WO1994002528A1 (es) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0828774B1 (de) * | 1995-05-24 | 1999-08-11 | Siemens Aktiengesellschaft | Epoxidharzformmassen mit halogenfreiem flammschutz |
CN1113083C (zh) * | 1998-06-09 | 2003-07-02 | 日东电工株式会社 | 半导体封装用环氧树脂组合物及使用了该组合物的半导体器件 |
WO2000077851A1 (en) * | 1999-06-15 | 2000-12-21 | Sumitomo Bakelite Company Limited | Method of producing epoxy for molding semiconductor device, molding material, and semiconductor device |
JP4568936B2 (ja) * | 2000-01-17 | 2010-10-27 | 住友ベークライト株式会社 | 難燃性樹脂組成物、これを用いたプリプレグ及び積層板 |
US7192997B2 (en) | 2001-02-07 | 2007-03-20 | International Business Machines Corporation | Encapsulant composition and electronic package utilizing same |
WO2012058657A2 (en) * | 2010-10-29 | 2012-05-03 | Hardcoat Surfaces Llc | High hardness low surface energy coating |
JP6060262B2 (ja) * | 2013-07-31 | 2017-01-11 | ミネベア株式会社 | 熱硬化性樹脂組成物及び摺動部材、並びに摺動部材の製造方法 |
RU2559442C2 (ru) * | 2013-09-23 | 2015-08-10 | Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг России) | Состав эпоксиполиуретанового компаунда и способ его получения |
US20150179477A1 (en) * | 2013-12-23 | 2015-06-25 | Stmicroelectronics, Inc. | Packaged ic devices and associated ic device packaging methods |
DE102020127830A1 (de) * | 2020-10-22 | 2022-04-28 | Infineon Technologies Ag | Moldverbindungen und Packages zum Verkapseln elektronischer Komponenten |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3028251A (en) * | 1956-11-20 | 1962-04-03 | Polymer Corp | Method of coating an article with a powdered resin composition and method of making the composition |
US3334110A (en) * | 1965-08-16 | 1967-08-01 | Baker Chem Co J T | Method for preparing epoxyoxazolidinones |
JPS5315757B2 (es) * | 1973-08-31 | 1978-05-26 | ||
JPS5331197B2 (es) | 1973-09-26 | 1978-08-31 | ||
JPS51128400A (en) | 1975-04-30 | 1976-11-09 | Hitachi Ltd | Thermosetting resin molding compounds |
US4401499A (en) * | 1980-06-09 | 1983-08-30 | Sumitomo Bakelite Company Limited | Crosslinked resin of epoxy compound and isocyanate and process for producing same |
ZA839459B (en) | 1982-12-30 | 1985-08-28 | Mobil Oil Corp | Polyoxazolidone powder coating compositions |
DE3323123A1 (de) * | 1983-06-27 | 1985-01-10 | Siemens AG, 1000 Berlin und 8000 München | Hitzehaertbare reaktionsharzmischungen |
DE3323154A1 (de) * | 1983-06-27 | 1985-01-03 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur impraegnierung und einbettung von elektrischen wicklungen |
DE3323122A1 (de) | 1983-06-27 | 1985-05-23 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung von reaktionsharzformstoffen |
DE3323084A1 (de) | 1983-06-27 | 1985-01-10 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung von formstoffen |
GB8412900D0 (en) * | 1984-05-21 | 1984-06-27 | Secr Defence | Thermosetting resin compositions |
JPS61181820A (ja) | 1985-02-06 | 1986-08-14 | Sumitomo Bakelite Co Ltd | 熱硬化性樹脂組成物 |
US4658007A (en) * | 1985-05-07 | 1987-04-14 | The Dow Chemical Company | Polyisocyanurate-based polyoxazolidone polymers and process for their preparation |
DE3720759A1 (de) | 1987-06-24 | 1989-01-05 | Bayer Ag | Oxazolidongruppen enthaltende epoxidharze |
US4906722A (en) * | 1987-12-02 | 1990-03-06 | Ciba-Geigy Corporation | Thermosetting reactive systems |
GB8912952D0 (en) * | 1989-06-06 | 1989-07-26 | Dow Rheinmuenster | Epoxy-terminated polyoxazolidones,process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones |
FI902943A0 (fi) * | 1989-07-19 | 1990-06-12 | Siemens Ag | I hetta haerdbara reaktionshartsblandningar. |
-
1992
- 1992-07-17 DE DE4223632A patent/DE4223632A1/de not_active Withdrawn
-
1993
- 1993-07-02 DE DE59307683T patent/DE59307683D1/de not_active Expired - Fee Related
- 1993-07-02 ES ES93912646T patent/ES2108873T3/es not_active Expired - Lifetime
- 1993-07-02 DK DK93912646T patent/DK0650504T3/da active
- 1993-07-02 KR KR1019950700180A patent/KR100243569B1/ko not_active IP Right Cessation
- 1993-07-02 EP EP93912646A patent/EP0650504B1/de not_active Expired - Lifetime
- 1993-07-02 WO PCT/DE1993/000584 patent/WO1994002528A1/de active IP Right Grant
- 1993-07-02 US US08/367,273 patent/US6225377B1/en not_active Expired - Fee Related
- 1993-07-02 JP JP50407094A patent/JP3267297B2/ja not_active Expired - Fee Related
- 1993-07-02 AT AT93912646T patent/ATE160154T1/de not_active IP Right Cessation
- 1993-07-14 MY MYPI93001389A patent/MY113697A/en unknown
Also Published As
Publication number | Publication date |
---|---|
DE4223632A1 (de) | 1994-01-20 |
EP0650504B1 (de) | 1997-11-12 |
JP3267297B2 (ja) | 2002-03-18 |
KR100243569B1 (ko) | 2000-02-01 |
US6225377B1 (en) | 2001-05-01 |
DE59307683D1 (de) | 1997-12-18 |
WO1994002528A1 (de) | 1994-02-03 |
EP0650504A1 (de) | 1995-05-03 |
KR950702590A (ko) | 1995-07-29 |
DK0650504T3 (da) | 1998-07-27 |
MY113697A (en) | 2002-05-31 |
JPH07509022A (ja) | 1995-10-05 |
ATE160154T1 (de) | 1997-11-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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