JPS5525474A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS5525474A
JPS5525474A JP9922878A JP9922878A JPS5525474A JP S5525474 A JPS5525474 A JP S5525474A JP 9922878 A JP9922878 A JP 9922878A JP 9922878 A JP9922878 A JP 9922878A JP S5525474 A JPS5525474 A JP S5525474A
Authority
JP
Japan
Prior art keywords
resin composition
epoxy resin
latent
curing agent
hardener
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9922878A
Other languages
Japanese (ja)
Inventor
Fumitoshi Yamashita
Tomiaki Sakano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP9922878A priority Critical patent/JPS5525474A/en
Publication of JPS5525474A publication Critical patent/JPS5525474A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: To provide an encapsulating resin composition for the encapsulation of electromagnetic winding without breaking or deforming the winding wire, by dissolving a specific carbonate in an epoxy resin mixture containing a latent curing agent as a crosslinking component.
CONSTITUTION: A resin composition composed of (A) a solid epoxy resin having a melting point of 40W100°C, (B) a curing agent comprising a hardener containing a latent catalyst, or a latent hardener, (pref. the combination of poly-p-vinylphenol having a molecular weight of ≥3000 and BF3-2-methylimidazole or Zn-acetylacetonate) and (C) (e.g. 5 PHR of) distearyl-4,5-epoxy cyclohexane.
EFFECT: Suitable for mass production. Free from pollution of working environment.
COPYRIGHT: (C)1980,JPO&Japio
JP9922878A 1978-08-14 1978-08-14 Epoxy resin composition Pending JPS5525474A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9922878A JPS5525474A (en) 1978-08-14 1978-08-14 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9922878A JPS5525474A (en) 1978-08-14 1978-08-14 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS5525474A true JPS5525474A (en) 1980-02-23

Family

ID=14241804

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9922878A Pending JPS5525474A (en) 1978-08-14 1978-08-14 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS5525474A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3117960A1 (en) * 1980-05-10 1982-03-25 Matsushita Electric Works Ltd., Kadoma, Osaka EPOXY RESIN COMPOSITION
JP2009105330A (en) * 2007-10-25 2009-05-14 Tdk Corp Composite material for magnetic core

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3117960A1 (en) * 1980-05-10 1982-03-25 Matsushita Electric Works Ltd., Kadoma, Osaka EPOXY RESIN COMPOSITION
US4399257A (en) * 1980-05-10 1983-08-16 Matsushita Electric Works, Ltd. Epoxy resin composition
JP2009105330A (en) * 2007-10-25 2009-05-14 Tdk Corp Composite material for magnetic core

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