DK440085D0 - Epoxyharpiksmateriale og fremgangsmaade til fremstilling af laminater deraf - Google Patents

Epoxyharpiksmateriale og fremgangsmaade til fremstilling af laminater deraf

Info

Publication number
DK440085D0
DK440085D0 DK440085A DK440085A DK440085D0 DK 440085 D0 DK440085 D0 DK 440085D0 DK 440085 A DK440085 A DK 440085A DK 440085 A DK440085 A DK 440085A DK 440085 D0 DK440085 D0 DK 440085D0
Authority
DK
Denmark
Prior art keywords
epoxy resin
laminates
procedures
production
resin materials
Prior art date
Application number
DK440085A
Other languages
English (en)
Other versions
DK440085A (da
Inventor
Raymond Koenig
Dieter H Klein
Robert Urscheler
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of DK440085A publication Critical patent/DK440085A/da
Publication of DK440085D0 publication Critical patent/DK440085D0/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
    • C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
    • C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
    • C08G14/06—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen
    • C08G14/10—Melamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C08G59/623—Aminophenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processing Of Terminals (AREA)
  • Manufacturing Of Electric Cables (AREA)
DK440085A 1984-01-31 1985-09-27 Epoxyharpiksmateriale og fremgangsmaade til fremstilling af laminater deraf DK440085D0 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3403172 1984-01-31
PCT/EP1985/000026 WO1985003515A1 (en) 1984-01-31 1985-01-30 Epoxy resin composition and process for preparing laminates therefrom

Publications (2)

Publication Number Publication Date
DK440085A DK440085A (da) 1985-09-27
DK440085D0 true DK440085D0 (da) 1985-09-27

Family

ID=6226300

Family Applications (1)

Application Number Title Priority Date Filing Date
DK440085A DK440085D0 (da) 1984-01-31 1985-09-27 Epoxyharpiksmateriale og fremgangsmaade til fremstilling af laminater deraf

Country Status (18)

Country Link
US (1) US4661568A (da)
EP (2) EP0169865A1 (da)
JP (1) JPS61501154A (da)
KR (2) KR920002615B1 (da)
AT (1) ATE35817T1 (da)
AU (1) AU557131B2 (da)
BR (1) BR8505172A (da)
CA (1) CA1276358C (da)
DE (1) DE3563852D1 (da)
DK (1) DK440085D0 (da)
ES (1) ES8608020A1 (da)
FI (1) FI853743A0 (da)
IE (1) IE57890B1 (da)
IL (1) IL74199A (da)
IN (1) IN164123B (da)
NO (1) NO161266C (da)
SG (1) SG87488G (da)
WO (1) WO1985003515A1 (da)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8519290D0 (en) * 1985-07-31 1985-09-04 Dow Chemical Rheinwerk Gmbh Resin composition
IL80277A0 (en) * 1985-10-15 1987-01-30 President Eng Corp Process for the production of prepregs and metal-laminated base material for circuit boards,and apparatus for carrying out this process
US4808652A (en) * 1988-06-08 1989-02-28 Monsanto Company Crosslinker compositions comprising amino resins, epoxies and styrene allyl alcohol copolymers
US5210157A (en) * 1989-08-15 1993-05-11 Akzo N.V. Interpenetrating network of ring-containing allyl polymers and epoxy resin, and a laminate prepared therefrom
MY131084A (en) * 1991-04-03 2007-07-31 Dow Chemical Co Epoxy resin compositions for use in electrical laminates.
US5364925A (en) * 1992-01-27 1994-11-15 The Dow Chemical Company Epoxy resin advanced with a dihydric phenol and further chain extended with an additional dihydric phenol for use in electrical laminates
DE69505410T2 (de) * 1994-09-08 1999-05-20 Akzo Nobel Nv Allylgruppen enthaltende zusammensetzungen aus epoxyharz und dem copolymer eines ethylenisch ungesättigten anhydrids und einer vinylverbindung
AU4953496A (en) * 1995-03-14 1996-10-02 Nissan Chemical Industries Ltd. Heat-resistant epoxy resin composition
DE69708908T2 (de) 1996-10-29 2002-07-18 Isola Laminate Systems Corp Copolymer aus styrol und maleinsäureanhydrid enthaltende epoxidharzzusammensetzung und covernetzer
JPH11279376A (ja) * 1998-03-27 1999-10-12 Hitachi Chem Co Ltd 印刷配線板用エポキシ樹脂組成物およびこれを用いた印刷配線板
US6855738B2 (en) 2003-06-06 2005-02-15 Dow Global Technologies Inc. Nanoporous laminates
CN103119079A (zh) * 2010-09-29 2013-05-22 日本电石工业株式会社 三聚氰胺环氧树脂单体及树脂组合物
US9193214B2 (en) 2012-10-12 2015-11-24 High Voltage Graphics, Inc. Flexible heat sealable decorative articles and method for making the same
US8911858B2 (en) 2012-10-31 2014-12-16 Empire Technology Development Llc Multifunctional melamine epoxy resins, methylols and amines
WO2014126626A1 (en) 2013-02-15 2014-08-21 Empire Technology Development Llc Phenolic epoxy compounds
WO2014200486A1 (en) 2013-06-13 2014-12-18 Empire Technology Development Llc Multi-functional phenolic resins
CN105814014B (zh) 2013-12-02 2018-06-12 英派尔科技开发有限公司 新型双子表面活性剂和它们的用途
US9526185B2 (en) * 2014-04-08 2016-12-20 Finisar Corporation Hybrid PCB with multi-unreinforced laminate
JP6735754B2 (ja) 2015-02-27 2020-08-05 ハンツマン・アドヴァンスト・マテリアルズ・ライセンシング・（スイッツランド）・ゲーエムベーハー 繊維強化複合成形品の製造方法、繊維強化複合成形品、およびそれらの使用

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB622675A (en) * 1946-10-02 1949-05-05 Donald Atherton Manufacture of new synthetic resinous condensation products
US3449228A (en) * 1965-04-01 1969-06-10 Ppg Industries Inc Aqueous compositions adapted for electrodeposition
US4499268A (en) * 1982-02-23 1985-02-12 Ciba Geigy Corporation Process for the preparation of isomelamines
US4467070A (en) * 1982-09-30 1984-08-21 Ford Motor Company Thermosetting coating composition comprising polymeric catalyst - III
US4393181A (en) * 1982-06-30 1983-07-12 Shell Oil Company Polyfunctional phenolic-melamine epoxy resin curing agents

Also Published As

Publication number Publication date
CA1276358C (en) 1990-11-13
EP0169865A1 (en) 1986-02-05
IE850224L (en) 1985-07-31
US4661568A (en) 1987-04-28
IL74199A0 (en) 1985-04-30
KR920002615B1 (ko) 1992-03-30
IL74199A (en) 1988-07-31
WO1985003515A1 (en) 1985-08-15
ATE35817T1 (de) 1988-08-15
NO161266B (no) 1989-04-17
EP0155469B1 (en) 1988-07-20
IN164123B (da) 1989-01-14
NO853822L (no) 1985-09-27
ES8608020A1 (es) 1986-04-16
DK440085A (da) 1985-09-27
JPS61501154A (ja) 1986-06-12
EP0155469A1 (en) 1985-09-25
SG87488G (en) 1989-06-16
JPH0369364B2 (da) 1991-10-31
ES539962A0 (es) 1986-04-16
DE3563852D1 (en) 1988-08-25
IE57890B1 (en) 1993-05-05
FI853743L (fi) 1985-09-27
KR850700252A (ko) 1985-12-26
FI853743A0 (fi) 1985-09-27
NO161266C (no) 1989-07-26
AU3934285A (en) 1985-08-27
AU557131B2 (en) 1986-12-04
BR8505172A (pt) 1986-01-21

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Legal Events

Date Code Title Description
AHB Application shelved due to non-payment