NO853822L - Epoksyharpiksmateriale, samt anvendelse av det ved fremstillng av laminater. - Google Patents

Epoksyharpiksmateriale, samt anvendelse av det ved fremstillng av laminater.

Info

Publication number
NO853822L
NO853822L NO853822A NO853822A NO853822L NO 853822 L NO853822 L NO 853822L NO 853822 A NO853822 A NO 853822A NO 853822 A NO853822 A NO 853822A NO 853822 L NO853822 L NO 853822L
Authority
NO
Norway
Prior art keywords
epoxy resin
laminates
manufacture
well
resin materials
Prior art date
Application number
NO853822A
Other languages
English (en)
Other versions
NO161266B (no
NO161266C (no
Inventor
Raymond Koenig
Dieter H Klein
Robert Urscheler
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of NO853822L publication Critical patent/NO853822L/no
Publication of NO161266B publication Critical patent/NO161266B/no
Publication of NO161266C publication Critical patent/NO161266C/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
    • C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
    • C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
    • C08G14/06—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen
    • C08G14/10—Melamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C08G59/623—Aminophenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Processing Of Terminals (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
NO85853822A 1984-01-31 1985-09-27 Epoksyharpiksmaterte for fremstillin g av elektriske laminater. NO161266C (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3403172 1984-01-31
PCT/EP1985/000026 WO1985003515A1 (en) 1984-01-31 1985-01-30 Epoxy resin composition and process for preparing laminates therefrom

Publications (3)

Publication Number Publication Date
NO853822L true NO853822L (no) 1985-09-27
NO161266B NO161266B (no) 1989-04-17
NO161266C NO161266C (no) 1989-07-26

Family

ID=6226300

Family Applications (1)

Application Number Title Priority Date Filing Date
NO85853822A NO161266C (no) 1984-01-31 1985-09-27 Epoksyharpiksmaterte for fremstillin g av elektriske laminater.

Country Status (18)

Country Link
US (1) US4661568A (no)
EP (2) EP0155469B1 (no)
JP (1) JPS61501154A (no)
KR (2) KR920002615B1 (no)
AT (1) ATE35817T1 (no)
AU (1) AU557131B2 (no)
BR (1) BR8505172A (no)
CA (1) CA1276358C (no)
DE (1) DE3563852D1 (no)
DK (1) DK440085D0 (no)
ES (1) ES8608020A1 (no)
FI (1) FI853743L (no)
IE (1) IE57890B1 (no)
IL (1) IL74199A (no)
IN (1) IN164123B (no)
NO (1) NO161266C (no)
SG (1) SG87488G (no)
WO (1) WO1985003515A1 (no)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8519290D0 (en) * 1985-07-31 1985-09-04 Dow Chemical Rheinwerk Gmbh Resin composition
IL80277A0 (en) * 1985-10-15 1987-01-30 President Eng Corp Process for the production of prepregs and metal-laminated base material for circuit boards,and apparatus for carrying out this process
US4808652A (en) * 1988-06-08 1989-02-28 Monsanto Company Crosslinker compositions comprising amino resins, epoxies and styrene allyl alcohol copolymers
US5210157A (en) * 1989-08-15 1993-05-11 Akzo N.V. Interpenetrating network of ring-containing allyl polymers and epoxy resin, and a laminate prepared therefrom
MY131084A (en) * 1991-04-03 2007-07-31 Dow Chemical Co Epoxy resin compositions for use in electrical laminates.
US5364925A (en) * 1992-01-27 1994-11-15 The Dow Chemical Company Epoxy resin advanced with a dihydric phenol and further chain extended with an additional dihydric phenol for use in electrical laminates
ES2124588T3 (es) * 1994-09-08 1999-02-01 Akzo Nobel Nv Composicion de resina epoxidica que contiene alilo que comprende un copolimero de un anhidrido etilenicamente insaturado y un compuesto vinilico.
WO1996028490A1 (fr) * 1995-03-14 1996-09-19 Nissan Chemical Industries, Ltd. Composition refractaire a base de resine epoxy
CA2270208C (en) 1996-10-29 2004-09-14 Akzo Nobel Nv Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross-linking agent
JPH11279376A (ja) * 1998-03-27 1999-10-12 Hitachi Chem Co Ltd 印刷配線板用エポキシ樹脂組成物およびこれを用いた印刷配線板
US6855738B2 (en) 2003-06-06 2005-02-15 Dow Global Technologies Inc. Nanoporous laminates
JPWO2012043245A1 (ja) * 2010-09-29 2014-02-06 日本カーバイド工業株式会社 メラミンエポキシ樹脂モノマーおよび樹脂組成物
CN104837645A (zh) 2012-10-12 2015-08-12 高压制图公司 柔性可热封装饰性制品及其制造方法
WO2014070155A1 (en) * 2012-10-31 2014-05-08 Empire Technology Development Llc Multifunctional melamine epoxy resins, methylols and amines
WO2014126626A1 (en) 2013-02-15 2014-08-21 Empire Technology Development Llc Phenolic epoxy compounds
EP3008125A4 (en) 2013-06-13 2016-12-07 Empire Technology Dev Llc MULTIFUNCTIONAL PHENOLIN RESINS
US10106494B2 (en) 2013-12-02 2018-10-23 Empire Technology Development Llc Gemini surfactant and their use
US9526185B2 (en) * 2014-04-08 2016-12-20 Finisar Corporation Hybrid PCB with multi-unreinforced laminate
EP3261814B1 (en) 2015-02-27 2023-04-19 Huntsman Advanced Materials Licensing (Switzerland) GmbH A process for manufacturing a fiber reinforced composite article, the composite article obtained and the use thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB622675A (en) * 1946-10-02 1949-05-05 Donald Atherton Manufacture of new synthetic resinous condensation products
US3449228A (en) * 1965-04-01 1969-06-10 Ppg Industries Inc Aqueous compositions adapted for electrodeposition
US4499268A (en) * 1982-02-23 1985-02-12 Ciba Geigy Corporation Process for the preparation of isomelamines
US4467070A (en) * 1982-09-30 1984-08-21 Ford Motor Company Thermosetting coating composition comprising polymeric catalyst - III
US4393181A (en) * 1982-06-30 1983-07-12 Shell Oil Company Polyfunctional phenolic-melamine epoxy resin curing agents

Also Published As

Publication number Publication date
SG87488G (en) 1989-06-16
JPS61501154A (ja) 1986-06-12
IN164123B (no) 1989-01-14
IE57890B1 (en) 1993-05-05
WO1985003515A1 (en) 1985-08-15
EP0155469A1 (en) 1985-09-25
FI853743A0 (fi) 1985-09-27
IE850224L (en) 1985-07-31
CA1276358C (en) 1990-11-13
DK440085A (da) 1985-09-27
JPH0369364B2 (no) 1991-10-31
US4661568A (en) 1987-04-28
AU557131B2 (en) 1986-12-04
NO161266B (no) 1989-04-17
ES539962A0 (es) 1986-04-16
DE3563852D1 (en) 1988-08-25
NO161266C (no) 1989-07-26
FI853743L (fi) 1985-09-27
IL74199A (en) 1988-07-31
ES8608020A1 (es) 1986-04-16
AU3934285A (en) 1985-08-27
KR920002615B1 (ko) 1992-03-30
EP0169865A1 (en) 1986-02-05
DK440085D0 (da) 1985-09-27
IL74199A0 (en) 1985-04-30
BR8505172A (pt) 1986-01-21
KR850700252A (ko) 1985-12-26
ATE35817T1 (de) 1988-08-15
EP0155469B1 (en) 1988-07-20

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