JPS54111545A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS54111545A
JPS54111545A JP1887078A JP1887078A JPS54111545A JP S54111545 A JPS54111545 A JP S54111545A JP 1887078 A JP1887078 A JP 1887078A JP 1887078 A JP1887078 A JP 1887078A JP S54111545 A JPS54111545 A JP S54111545A
Authority
JP
Japan
Prior art keywords
diphenyl ether
phenylphenol
weight
condensation
reacting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1887078A
Other languages
Japanese (ja)
Other versions
JPS6154060B2 (en
Inventor
Akira Fukami
Yasushi Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1887078A priority Critical patent/JPS54111545A/en
Publication of JPS54111545A publication Critical patent/JPS54111545A/en
Publication of JPS6154060B2 publication Critical patent/JPS6154060B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)

Abstract

PURPOSE: To provide a thermosetting resin composition having excellent heat resistance, electrical properties, mechanical properties, water resistance, etc., composed of a diphenyl ether/p-phenylphenol co-condensation resol resin and an alkyd resin.
CONSTITUTION: The title composition is obtained by compounding (A) a diphenyl ether/p-phenylphenol co-condensation resol resin prepared by (1) reacting (a) 100 parts by weight of hydroxymethyl diphenyl ether or methoxymethyl diphenyl ether having 1.8W2.2 substitution groups per diphenyl ether skeleton on an average with (b) 90W140 parts by weight of p-phenylphenol at 100W260°C for 2W10 hours, and (2) reacting the reaction product of (1) with formaldehyde in an organic solvent in the presence of an alkaline catalyst at 50W110°C, and (B) an alkyd resin synthesized from tris(2-hydroxyethyl)-isocyanurate, isophthalic acid, and a (semi-)drying oil. The weight ratio of (A) to (B) is 2W7 to 8W3.
COPYRIGHT: (C)1979,JPO&Japio
JP1887078A 1978-02-20 1978-02-20 Thermosetting resin composition Granted JPS54111545A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1887078A JPS54111545A (en) 1978-02-20 1978-02-20 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1887078A JPS54111545A (en) 1978-02-20 1978-02-20 Thermosetting resin composition

Publications (2)

Publication Number Publication Date
JPS54111545A true JPS54111545A (en) 1979-08-31
JPS6154060B2 JPS6154060B2 (en) 1986-11-20

Family

ID=11983567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1887078A Granted JPS54111545A (en) 1978-02-20 1978-02-20 Thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS54111545A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1074023C (en) * 1998-06-09 2001-10-31 铁道部株洲电力机车研究所 Non-solvent dipping varnish and its preparing process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1074023C (en) * 1998-06-09 2001-10-31 铁道部株洲电力机车研究所 Non-solvent dipping varnish and its preparing process

Also Published As

Publication number Publication date
JPS6154060B2 (en) 1986-11-20

Similar Documents

Publication Publication Date Title
JPS56115322A (en) Preparation of thermosetting maleimide prepolymer
JPS5536216A (en) Curing of organoalkoxysilane compound
KR850700252A (en) Epoxy resin composition and method for manufacturing laminate from there
JPS5533422A (en) Production of ethylene glycol mono-tertiary-butyl ether
JPS562322A (en) Preparation of polyamide resin
JPS5736172A (en) Offset ink composition
JPS54111545A (en) Thermosetting resin composition
CN109678880A (en) A kind of trifunctional benzoxazine monomer and preparation method thereof based on resveratrol
JPS54106456A (en) Novel hydroxyalkylation process of bisphenols
JPS5464597A (en) Heat resistant epoxy resin composition
JPS5650910A (en) Air-curable unsaturated polyester resin composition
JPS54108896A (en) Thermosetting resin composition
JPS562323A (en) Preparation of polyamide resin
JPS55715A (en) Novel resin composition laminate
JPS55120620A (en) Production of modified phenolic resin
JPS5241691A (en) Prcess for producing eat resistant laminates and preparing a modified phenol resin suitable for them
JPS544994A (en) Epoxy resin composition
JPS548699A (en) Preparation of aromatic polyester
JPS54160496A (en) Curable composition
SU469724A1 (en) Binder for laminated plastics
JPS5687588A (en) Preparation of phosphorus-containing oligomer
JPS5273956A (en) Fluorine-containing resin compositions
JPS56129214A (en) Production of high-molecular compound
JPS55142023A (en) Thermosetting resin composition
JPS5558225A (en) Production of solution of heat-resistant resin