JPS6146026B2 - - Google Patents
Info
- Publication number
- JPS6146026B2 JPS6146026B2 JP5034080A JP5034080A JPS6146026B2 JP S6146026 B2 JPS6146026 B2 JP S6146026B2 JP 5034080 A JP5034080 A JP 5034080A JP 5034080 A JP5034080 A JP 5034080A JP S6146026 B2 JPS6146026 B2 JP S6146026B2
- Authority
- JP
- Japan
- Prior art keywords
- polyesteramide
- resin
- adhesive
- epoxy resin
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5034080A JPS56160091A (en) | 1980-04-18 | 1980-04-18 | Adhesive for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5034080A JPS56160091A (en) | 1980-04-18 | 1980-04-18 | Adhesive for printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56160091A JPS56160091A (en) | 1981-12-09 |
| JPS6146026B2 true JPS6146026B2 (enrdf_load_stackoverflow) | 1986-10-11 |
Family
ID=12856184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5034080A Granted JPS56160091A (en) | 1980-04-18 | 1980-04-18 | Adhesive for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56160091A (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR960704977A (ko) * | 1994-07-18 | 1996-10-09 | 마에다 가쯔노스께 | 에폭시 수지 조성물, 프리프레그 및 섬유 강화 복합 재료(An Epoxy Resin Composition, a Prepreg and a Fiber Reinforced Composite Material) |
| JP2001354938A (ja) * | 2000-06-12 | 2001-12-25 | Toray Ind Inc | 半導体装置用接着剤組成物およびそれを用いた接着剤シート、半導体接続用基板ならびに半導体装置 |
| JP2005008856A (ja) * | 2003-03-28 | 2005-01-13 | M & S Kenkyu Kaihatsu Kk | ポリエステルとジアミンとによるポリマー化合物の製造方法、ポリマー化合物、および該ポリマー化合物を含む構造体 |
| JP4645170B2 (ja) * | 2004-11-25 | 2011-03-09 | 東洋紡績株式会社 | 接着剤およびそれを用いたフレキシブル印刷回路基板 |
-
1980
- 1980-04-18 JP JP5034080A patent/JPS56160091A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56160091A (en) | 1981-12-09 |
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