JPS56160091A - Adhesive for printed circuit board - Google Patents

Adhesive for printed circuit board

Info

Publication number
JPS56160091A
JPS56160091A JP5034080A JP5034080A JPS56160091A JP S56160091 A JPS56160091 A JP S56160091A JP 5034080 A JP5034080 A JP 5034080A JP 5034080 A JP5034080 A JP 5034080A JP S56160091 A JPS56160091 A JP S56160091A
Authority
JP
Japan
Prior art keywords
adhesive
circuit board
printed circuit
printed
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5034080A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6146026B2 (enrdf_load_stackoverflow
Inventor
Kazumi Nagai
Chiaki Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP5034080A priority Critical patent/JPS56160091A/ja
Publication of JPS56160091A publication Critical patent/JPS56160091A/ja
Publication of JPS6146026B2 publication Critical patent/JPS6146026B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP5034080A 1980-04-18 1980-04-18 Adhesive for printed circuit board Granted JPS56160091A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5034080A JPS56160091A (en) 1980-04-18 1980-04-18 Adhesive for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5034080A JPS56160091A (en) 1980-04-18 1980-04-18 Adhesive for printed circuit board

Publications (2)

Publication Number Publication Date
JPS56160091A true JPS56160091A (en) 1981-12-09
JPS6146026B2 JPS6146026B2 (enrdf_load_stackoverflow) 1986-10-11

Family

ID=12856184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5034080A Granted JPS56160091A (en) 1980-04-18 1980-04-18 Adhesive for printed circuit board

Country Status (1)

Country Link
JP (1) JPS56160091A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996002592A1 (fr) * 1994-07-18 1996-02-01 Toray Industries, Inc. Composition de resine epoxyde, preimpregne et materiau composite renforce par des fibres
JP2001354938A (ja) * 2000-06-12 2001-12-25 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いた接着剤シート、半導体接続用基板ならびに半導体装置
JP2005008856A (ja) * 2003-03-28 2005-01-13 M & S Kenkyu Kaihatsu Kk ポリエステルとジアミンとによるポリマー化合物の製造方法、ポリマー化合物、および該ポリマー化合物を含む構造体
JP2006152015A (ja) * 2004-11-25 2006-06-15 Toyobo Co Ltd 接着剤およびそれを用いたフレキシブル印刷回路基板

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996002592A1 (fr) * 1994-07-18 1996-02-01 Toray Industries, Inc. Composition de resine epoxyde, preimpregne et materiau composite renforce par des fibres
JP2001354938A (ja) * 2000-06-12 2001-12-25 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いた接着剤シート、半導体接続用基板ならびに半導体装置
JP2005008856A (ja) * 2003-03-28 2005-01-13 M & S Kenkyu Kaihatsu Kk ポリエステルとジアミンとによるポリマー化合物の製造方法、ポリマー化合物、および該ポリマー化合物を含む構造体
JP2006152015A (ja) * 2004-11-25 2006-06-15 Toyobo Co Ltd 接着剤およびそれを用いたフレキシブル印刷回路基板

Also Published As

Publication number Publication date
JPS6146026B2 (enrdf_load_stackoverflow) 1986-10-11

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