JPS6136168A - 多層回路板とその製造方法 - Google Patents

多層回路板とその製造方法

Info

Publication number
JPS6136168A
JPS6136168A JP59155607A JP15560784A JPS6136168A JP S6136168 A JPS6136168 A JP S6136168A JP 59155607 A JP59155607 A JP 59155607A JP 15560784 A JP15560784 A JP 15560784A JP S6136168 A JPS6136168 A JP S6136168A
Authority
JP
Japan
Prior art keywords
mullite
silica
strength
dielectric constant
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59155607A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0249265B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
永山　更成
信之 牛房
浩一 篠原
荻原　覚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59155607A priority Critical patent/JPS6136168A/ja
Publication of JPS6136168A publication Critical patent/JPS6136168A/ja
Publication of JPH0249265B2 publication Critical patent/JPH0249265B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass

Landscapes

  • Compositions Of Oxide Ceramics (AREA)
  • Inorganic Insulating Materials (AREA)
JP59155607A 1984-07-27 1984-07-27 多層回路板とその製造方法 Granted JPS6136168A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59155607A JPS6136168A (ja) 1984-07-27 1984-07-27 多層回路板とその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59155607A JPS6136168A (ja) 1984-07-27 1984-07-27 多層回路板とその製造方法

Publications (2)

Publication Number Publication Date
JPS6136168A true JPS6136168A (ja) 1986-02-20
JPH0249265B2 JPH0249265B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-10-29

Family

ID=15609720

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59155607A Granted JPS6136168A (ja) 1984-07-27 1984-07-27 多層回路板とその製造方法

Country Status (1)

Country Link
JP (1) JPS6136168A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61266350A (ja) * 1985-05-21 1986-11-26 株式会社日立製作所 配線回路用セラミック基板
US4735925A (en) * 1985-06-14 1988-04-05 Ngk Spark Plug Co., Ltd. Low-temperature sinterable ceramic composition
JPS63265859A (ja) * 1987-04-23 1988-11-02 Agency Of Ind Science & Technol セラミツク絶縁材料
JPH01317164A (ja) * 1988-03-02 1989-12-21 Shinko Electric Ind Co Ltd セラミック組成物
JPH02111658A (ja) * 1988-10-18 1990-04-24 Shinko Electric Ind Co Ltd セラミック絶縁材料およびその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5729437A (en) * 1980-07-29 1982-02-17 Shinobu Okuyama Receiver for extrudate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5729437A (en) * 1980-07-29 1982-02-17 Shinobu Okuyama Receiver for extrudate

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61266350A (ja) * 1985-05-21 1986-11-26 株式会社日立製作所 配線回路用セラミック基板
US4735925A (en) * 1985-06-14 1988-04-05 Ngk Spark Plug Co., Ltd. Low-temperature sinterable ceramic composition
JPS63265859A (ja) * 1987-04-23 1988-11-02 Agency Of Ind Science & Technol セラミツク絶縁材料
JPH01317164A (ja) * 1988-03-02 1989-12-21 Shinko Electric Ind Co Ltd セラミック組成物
US4963514A (en) * 1988-03-02 1990-10-16 Shinko Electric Industries Co., Ltd. Ceramic mullite-silica glass composite
JPH02111658A (ja) * 1988-10-18 1990-04-24 Shinko Electric Ind Co Ltd セラミック絶縁材料およびその製造方法

Also Published As

Publication number Publication date
JPH0249265B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-10-29

Similar Documents

Publication Publication Date Title
EP0211619A2 (en) A multilayer ceramic circuit board
JPS63314855A (ja) セラミツクパツケ−ジ
KR100284068B1 (ko) 지지 기판상의 다층 세라믹 회로판용 전도성 비아 충전 잉크
JPS6043890A (ja) 集積回路装置を装着するための誘電体基板
US4935285A (en) Ceramic substrates for microelectronic circuits and process for producing same
JP2642253B2 (ja) ガラス−セラミックス複合体
JPH0524107B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS6136168A (ja) 多層回路板とその製造方法
JPH11177238A (ja) ガラスセラミックス多層基板の製造方法
JPH02225339A (ja) ガラスセラミック焼結体
JPS61168564A (ja) セラミツク絶縁基板
JP3121769B2 (ja) 窒化ケイ素多層基板およびその製造方法
JPS61101457A (ja) セラミツク絶縁基板材料
JPH04114931A (ja) ガラスセラミック焼結体の製法
JPH02225338A (ja) ガラスセラミック焼結体
JP2523266B2 (ja) 配線回路用セラミック基板の製造方法
JPS63169098A (ja) セラミツク多層回路板
JPH075359B2 (ja) セラミツク絶縁基板の製法
JPS6360153A (ja) ムライト系セラミツク絶縁基板
JPH0283255A (ja) ムライト系セラミツク材料を用いた多層回路板及び半導体モジュール
JPH06316463A (ja) セラミック多層回路板用原料粉末および微結晶セラミック多層回路板
JPS6272555A (ja) ムライト系焼結体用粉末組成物
JPS6175588A (ja) セラミツク多層配線基板材料
JPS62150856A (ja) セラミツク多層基板材料
JPH06196863A (ja) 多層セラミック配線基板及びその製造方法