JPS6134751U - 半導体集積回路装置 - Google Patents

半導体集積回路装置

Info

Publication number
JPS6134751U
JPS6134751U JP1984118664U JP11866484U JPS6134751U JP S6134751 U JPS6134751 U JP S6134751U JP 1984118664 U JP1984118664 U JP 1984118664U JP 11866484 U JP11866484 U JP 11866484U JP S6134751 U JPS6134751 U JP S6134751U
Authority
JP
Japan
Prior art keywords
semiconductor integrated
integrated circuit
circuit device
pad
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984118664U
Other languages
English (en)
Japanese (ja)
Other versions
JPH025538Y2 (enExample
Inventor
逸雄 福井
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP1984118664U priority Critical patent/JPS6134751U/ja
Publication of JPS6134751U publication Critical patent/JPS6134751U/ja
Application granted granted Critical
Publication of JPH025538Y2 publication Critical patent/JPH025538Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5453—Dispositions of bond wires connecting between multiple bond pads on a chip, e.g. daisy chain
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/936—Multiple bond pads having different shapes

Landscapes

  • Wire Bonding (AREA)
JP1984118664U 1984-07-31 1984-07-31 半導体集積回路装置 Granted JPS6134751U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984118664U JPS6134751U (ja) 1984-07-31 1984-07-31 半導体集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984118664U JPS6134751U (ja) 1984-07-31 1984-07-31 半導体集積回路装置

Publications (2)

Publication Number Publication Date
JPS6134751U true JPS6134751U (ja) 1986-03-03
JPH025538Y2 JPH025538Y2 (enExample) 1990-02-09

Family

ID=30677544

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984118664U Granted JPS6134751U (ja) 1984-07-31 1984-07-31 半導体集積回路装置

Country Status (1)

Country Link
JP (1) JPS6134751U (enExample)

Also Published As

Publication number Publication date
JPH025538Y2 (enExample) 1990-02-09

Similar Documents

Publication Publication Date Title
JPS5827935U (ja) 混成集積回路装置
JPS6134751U (ja) 半導体集積回路装置
JPS60183439U (ja) 集積回路
JPS60113636U (ja) 半導体集積回路装置
JPS60130649U (ja) 樹脂封止型半導体装置
JPS6013737U (ja) 半導体集積回路装置
JPS602848U (ja) 半導体装置
JPS60163751U (ja) 半導体装置
JPS60106375U (ja) 外部リ−ド端子の取付構造
JPS59145047U (ja) 半導体装置
JPS6039254U (ja) 半導体集積回路装置
JPS6112249U (ja) 半導体装置
JPS59191744U (ja) 半導体装置
JPS60181051U (ja) リ−ドフレ−ムの構造
JPS6063947U (ja) 半導体集積回路容器
JPS60931U (ja) 半導体装置
JPS602849U (ja) 集積回路装置
JPS60153543U (ja) 半導体装置用リ−ドフレ−ム
JPS5860950U (ja) パツケ−ジ
JPS6081664U (ja) 集積回路パツケ−ジ
JPS6061729U (ja) 半導体装置
JPS6068656U (ja) 放熱板付半導体装置
JPS5853160U (ja) 非晶質半導体装置
JPS6037253U (ja) 半導体装置
JPS59112955U (ja) 半導体素子