JPS6134751U - 半導体集積回路装置 - Google Patents
半導体集積回路装置Info
- Publication number
- JPS6134751U JPS6134751U JP1984118664U JP11866484U JPS6134751U JP S6134751 U JPS6134751 U JP S6134751U JP 1984118664 U JP1984118664 U JP 1984118664U JP 11866484 U JP11866484 U JP 11866484U JP S6134751 U JPS6134751 U JP S6134751U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor integrated
- integrated circuit
- circuit device
- pad
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/90—
-
- H10W70/60—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W72/5449—
-
- H10W72/5453—
-
- H10W72/5473—
-
- H10W72/59—
-
- H10W72/926—
-
- H10W72/932—
-
- H10W72/936—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984118664U JPS6134751U (ja) | 1984-07-31 | 1984-07-31 | 半導体集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984118664U JPS6134751U (ja) | 1984-07-31 | 1984-07-31 | 半導体集積回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6134751U true JPS6134751U (ja) | 1986-03-03 |
| JPH025538Y2 JPH025538Y2 (enExample) | 1990-02-09 |
Family
ID=30677544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984118664U Granted JPS6134751U (ja) | 1984-07-31 | 1984-07-31 | 半導体集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6134751U (enExample) |
-
1984
- 1984-07-31 JP JP1984118664U patent/JPS6134751U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH025538Y2 (enExample) | 1990-02-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5827935U (ja) | 混成集積回路装置 | |
| JPS6134751U (ja) | 半導体集積回路装置 | |
| JPS60183439U (ja) | 集積回路 | |
| JPS60113636U (ja) | 半導体集積回路装置 | |
| JPS60130649U (ja) | 樹脂封止型半導体装置 | |
| JPS6013737U (ja) | 半導体集積回路装置 | |
| JPS602848U (ja) | 半導体装置 | |
| JPS60163751U (ja) | 半導体装置 | |
| JPS60106375U (ja) | 外部リ−ド端子の取付構造 | |
| JPS59145047U (ja) | 半導体装置 | |
| JPS6039254U (ja) | 半導体集積回路装置 | |
| JPS6112249U (ja) | 半導体装置 | |
| JPS59191744U (ja) | 半導体装置 | |
| JPS60181051U (ja) | リ−ドフレ−ムの構造 | |
| JPS6063947U (ja) | 半導体集積回路容器 | |
| JPS60931U (ja) | 半導体装置 | |
| JPS602849U (ja) | 集積回路装置 | |
| JPS60153543U (ja) | 半導体装置用リ−ドフレ−ム | |
| JPS5860950U (ja) | パツケ−ジ | |
| JPS6081664U (ja) | 集積回路パツケ−ジ | |
| JPS6061729U (ja) | 半導体装置 | |
| JPS6068656U (ja) | 放熱板付半導体装置 | |
| JPS5853160U (ja) | 非晶質半導体装置 | |
| JPS6037253U (ja) | 半導体装置 | |
| JPS59112955U (ja) | 半導体素子 |