JPH025538Y2 - - Google Patents

Info

Publication number
JPH025538Y2
JPH025538Y2 JP1984118664U JP11866484U JPH025538Y2 JP H025538 Y2 JPH025538 Y2 JP H025538Y2 JP 1984118664 U JP1984118664 U JP 1984118664U JP 11866484 U JP11866484 U JP 11866484U JP H025538 Y2 JPH025538 Y2 JP H025538Y2
Authority
JP
Japan
Prior art keywords
circuit
bonding pad
elements
thin metal
pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984118664U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6134751U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984118664U priority Critical patent/JPS6134751U/ja
Publication of JPS6134751U publication Critical patent/JPS6134751U/ja
Application granted granted Critical
Publication of JPH025538Y2 publication Critical patent/JPH025538Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H10W70/60—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5449—
    • H10W72/5453—
    • H10W72/5473—
    • H10W72/59—
    • H10W72/926—
    • H10W72/932—
    • H10W72/936—

Landscapes

  • Wire Bonding (AREA)
JP1984118664U 1984-07-31 1984-07-31 半導体集積回路装置 Granted JPS6134751U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984118664U JPS6134751U (ja) 1984-07-31 1984-07-31 半導体集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984118664U JPS6134751U (ja) 1984-07-31 1984-07-31 半導体集積回路装置

Publications (2)

Publication Number Publication Date
JPS6134751U JPS6134751U (ja) 1986-03-03
JPH025538Y2 true JPH025538Y2 (enExample) 1990-02-09

Family

ID=30677544

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984118664U Granted JPS6134751U (ja) 1984-07-31 1984-07-31 半導体集積回路装置

Country Status (1)

Country Link
JP (1) JPS6134751U (enExample)

Also Published As

Publication number Publication date
JPS6134751U (ja) 1986-03-03

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