JPS6132822B2 - - Google Patents

Info

Publication number
JPS6132822B2
JPS6132822B2 JP55170411A JP17041180A JPS6132822B2 JP S6132822 B2 JPS6132822 B2 JP S6132822B2 JP 55170411 A JP55170411 A JP 55170411A JP 17041180 A JP17041180 A JP 17041180A JP S6132822 B2 JPS6132822 B2 JP S6132822B2
Authority
JP
Japan
Prior art keywords
pads
pad
semiconductor
lead
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55170411A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5793559A (en
Inventor
Takashi Myamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP55170411A priority Critical patent/JPS5793559A/ja
Publication of JPS5793559A publication Critical patent/JPS5793559A/ja
Publication of JPS6132822B2 publication Critical patent/JPS6132822B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts

Landscapes

  • Wire Bonding (AREA)
JP55170411A 1980-12-03 1980-12-03 Semiconductor device Granted JPS5793559A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55170411A JPS5793559A (en) 1980-12-03 1980-12-03 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55170411A JPS5793559A (en) 1980-12-03 1980-12-03 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5793559A JPS5793559A (en) 1982-06-10
JPS6132822B2 true JPS6132822B2 (enExample) 1986-07-29

Family

ID=15904420

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55170411A Granted JPS5793559A (en) 1980-12-03 1980-12-03 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5793559A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57145356A (en) * 1981-03-03 1982-09-08 Nec Corp Semiconductor device
DE3680265D1 (de) * 1985-02-28 1991-08-22 Sony Corp Halbleiterschaltungsanordnung.
US5237201A (en) * 1989-07-21 1993-08-17 Kabushiki Kaisha Toshiba TAB type semiconductor device and method of manufacturing the same
JPH0521744U (ja) * 1991-09-07 1993-03-23 コクヨ株式会社 デイスク用敷物

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2528119A1 (de) * 1975-06-24 1977-01-20 Siemens Ag Elektrisch leitendes band

Also Published As

Publication number Publication date
JPS5793559A (en) 1982-06-10

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