JPH04387B2 - - Google Patents

Info

Publication number
JPH04387B2
JPH04387B2 JP56003379A JP337981A JPH04387B2 JP H04387 B2 JPH04387 B2 JP H04387B2 JP 56003379 A JP56003379 A JP 56003379A JP 337981 A JP337981 A JP 337981A JP H04387 B2 JPH04387 B2 JP H04387B2
Authority
JP
Japan
Prior art keywords
leads
lead
branched
wide
large number
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56003379A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57117265A (en
Inventor
Takashi Myamoto
Kazufumi Terachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP56003379A priority Critical patent/JPS57117265A/ja
Publication of JPS57117265A publication Critical patent/JPS57117265A/ja
Publication of JPH04387B2 publication Critical patent/JPH04387B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/65—
    • H10W72/701—
    • H10W90/734—

Landscapes

  • Wire Bonding (AREA)
JP56003379A 1981-01-13 1981-01-13 Semiconductor device Granted JPS57117265A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56003379A JPS57117265A (en) 1981-01-13 1981-01-13 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56003379A JPS57117265A (en) 1981-01-13 1981-01-13 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS57117265A JPS57117265A (en) 1982-07-21
JPH04387B2 true JPH04387B2 (enExample) 1992-01-07

Family

ID=11555715

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56003379A Granted JPS57117265A (en) 1981-01-13 1981-01-13 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57117265A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3680265D1 (de) * 1985-02-28 1991-08-22 Sony Corp Halbleiterschaltungsanordnung.
JPS6359593A (ja) * 1986-08-30 1988-03-15 株式会社東芝 携帯可能媒体における実装方法
JPH02213148A (ja) * 1989-02-14 1990-08-24 Seiko Epson Corp テープキャリア
JPH02295143A (ja) * 1989-05-09 1990-12-06 Nec Corp 集積回路
JP3772886B2 (ja) 2003-12-22 2006-05-10 ブラザー工業株式会社 プリント基板及びインクジェットヘッド
JP5737966B2 (ja) * 2011-01-25 2015-06-17 キヤノン株式会社 液体吐出ヘッドおよび液体吐出ヘッドの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49133558U (enExample) * 1973-03-20 1974-11-16
DE2528119A1 (de) * 1975-06-24 1977-01-20 Siemens Ag Elektrisch leitendes band

Also Published As

Publication number Publication date
JPS57117265A (en) 1982-07-21

Similar Documents

Publication Publication Date Title
JP3779789B2 (ja) 半導体装置およびその製造方法
US4754317A (en) Integrated circuit die-to-lead frame interconnection assembly and method
US6087716A (en) Semiconductor device package having a connection substrate with turned back leads and method thereof
US4878098A (en) Semiconductor integrated circuit device
JPS62150728A (ja) テ−プキヤリアおよびそれを用いた半導体装置
US3900813A (en) Galvano-magnetro effect device
TW487996B (en) Wiring substrate and semiconductor device
JPH04387B2 (enExample)
JPH1064946A (ja) 半導体装置及びその製造方法
CN113192925B (zh) 功率半导体器件
JPH0740576B2 (ja) フィルムキャリヤ半導体装置の電気試験方法
JPS60138948A (ja) 半導体装置用パツケ−ジ
JP2806168B2 (ja) 樹脂封止型半導体装置
JPS6243139A (ja) 半導体素子およびその実装方法
JPS628019B2 (enExample)
JP3251810B2 (ja) 集積回路装置の実装方法
JPS6132822B2 (enExample)
JPS61185949A (ja) フイルムキヤリアにアツセンブリされた半導体集積回路のエ−ジング方法
JP2871575B2 (ja) リードフレームおよびその製造方法ならびに樹脂封止型半導体装置およびその製造方法
JPH05160215A (ja) 半導体装置用評価装置
JPH077037A (ja) 半導体集積回路装置
JP2990120B2 (ja) 半導体装置
JPH02130946A (ja) 半導体装置
JPH02213148A (ja) テープキャリア
JP3358697B2 (ja) 半導体パッケージ