JPS6134376B2 - - Google Patents
Info
- Publication number
- JPS6134376B2 JPS6134376B2 JP5722779A JP5722779A JPS6134376B2 JP S6134376 B2 JPS6134376 B2 JP S6134376B2 JP 5722779 A JP5722779 A JP 5722779A JP 5722779 A JP5722779 A JP 5722779A JP S6134376 B2 JPS6134376 B2 JP S6134376B2
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- metal foil
- resin film
- composite
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000007788 liquid Substances 0.000 claims description 23
- 239000002131 composite material Substances 0.000 claims description 21
- 229920005672 polyolefin resin Polymers 0.000 claims description 20
- 239000005062 Polybutadiene Substances 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 229920002857 polybutadiene Polymers 0.000 claims description 19
- 229920000642 polymer Polymers 0.000 claims description 19
- 239000011888 foil Substances 0.000 claims description 18
- 239000004745 nonwoven fabric Substances 0.000 claims description 17
- 239000002759 woven fabric Substances 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 238000010894 electron beam technology Methods 0.000 claims description 9
- 238000004132 cross linking Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 description 16
- 239000000758 substrate Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 12
- 239000000203 mixture Substances 0.000 description 9
- 239000004744 fabric Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 150000001336 alkenes Chemical class 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- 230000002730 additional effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- 241000156978 Erebia Species 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 239000012210 heat-resistant fiber Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 241000894007 species Species 0.000 description 1
- -1 vinyl compound Chemical class 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
Landscapes
- Laminated Bodies (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5722779A JPS55148488A (en) | 1979-05-09 | 1979-05-09 | Method of fabricating flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5722779A JPS55148488A (en) | 1979-05-09 | 1979-05-09 | Method of fabricating flexible printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55148488A JPS55148488A (en) | 1980-11-19 |
| JPS6134376B2 true JPS6134376B2 (enrdf_load_stackoverflow) | 1986-08-07 |
Family
ID=13049634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5722779A Granted JPS55148488A (en) | 1979-05-09 | 1979-05-09 | Method of fabricating flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55148488A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6065598A (ja) * | 1983-09-20 | 1985-04-15 | 松下電器産業株式会社 | 多層印刷配線板の製造方法 |
-
1979
- 1979-05-09 JP JP5722779A patent/JPS55148488A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55148488A (en) | 1980-11-19 |
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