JPS6133258B2 - - Google Patents
Info
- Publication number
- JPS6133258B2 JPS6133258B2 JP52151973A JP15197377A JPS6133258B2 JP S6133258 B2 JPS6133258 B2 JP S6133258B2 JP 52151973 A JP52151973 A JP 52151973A JP 15197377 A JP15197377 A JP 15197377A JP S6133258 B2 JPS6133258 B2 JP S6133258B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- present
- leads
- view
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/07251—
-
- H10W72/20—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15197377A JPS5483768A (en) | 1977-12-16 | 1977-12-16 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15197377A JPS5483768A (en) | 1977-12-16 | 1977-12-16 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5483768A JPS5483768A (en) | 1979-07-04 |
| JPS6133258B2 true JPS6133258B2 (enExample) | 1986-08-01 |
Family
ID=15530260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15197377A Granted JPS5483768A (en) | 1977-12-16 | 1977-12-16 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5483768A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4862322A (en) * | 1988-05-02 | 1989-08-29 | Bickford Harry R | Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween |
| US5530292A (en) * | 1990-03-15 | 1996-06-25 | Fujitsu Limited | Semiconductor device having a plurality of chips |
| KR920702024A (ko) * | 1990-03-15 | 1992-08-12 | 세끼사와 요시 | 다수의 칩을 갖는 반도체 장치 |
| JPH061762U (ja) * | 1992-06-08 | 1994-01-14 | 日野自動車工業株式会社 | ディーゼルエンジンの排気ガス再循環装置 |
-
1977
- 1977-12-16 JP JP15197377A patent/JPS5483768A/ja active Granted
Non-Patent Citations (1)
| Title |
|---|
| IBM TECHNICAL DISCLOSURE BULLETIN * |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5483768A (en) | 1979-07-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS62126661A (ja) | 混成集積回路装置 | |
| JP3494901B2 (ja) | 半導体集積回路装置 | |
| JPS5845822B2 (ja) | シユウセキカイロ | |
| JP2005203775A (ja) | マルチチップパッケージ | |
| JPH04196263A (ja) | 半導体集積回路 | |
| JPS6133258B2 (enExample) | ||
| JP3316409B2 (ja) | 複数のicチップを備えた半導体装置の構造 | |
| JP3815933B2 (ja) | 半導体装置及びその製造方法 | |
| JP3043484B2 (ja) | 半導体装置 | |
| JPH04116860A (ja) | 半導体装置 | |
| JPH04199563A (ja) | 半導体集積回路用パッケージ | |
| JPS61259533A (ja) | 半導体装置 | |
| JPH04206654A (ja) | リードフレームおよび半導体装置 | |
| JP2701348B2 (ja) | 半導体装置 | |
| JP2504051B2 (ja) | 電界効果トランジスタ | |
| JPS62108534A (ja) | 半導体装置 | |
| JPS5810041U (ja) | 半導体圧力変換器 | |
| JPS5889852A (ja) | 半導体装置 | |
| JPS5861652A (ja) | 半導体装置 | |
| JPS602849U (ja) | 集積回路装置 | |
| JPH1022329A (ja) | 半導体装置 | |
| JPS62180738U (enExample) | ||
| JPH03236245A (ja) | 半導体装置 | |
| JPS62265733A (ja) | 混成集積回路装置 | |
| JPH03116032U (enExample) |