JPS6130041A - 半導体装置組立装置 - Google Patents
半導体装置組立装置Info
- Publication number
- JPS6130041A JPS6130041A JP15060884A JP15060884A JPS6130041A JP S6130041 A JPS6130041 A JP S6130041A JP 15060884 A JP15060884 A JP 15060884A JP 15060884 A JP15060884 A JP 15060884A JP S6130041 A JPS6130041 A JP S6130041A
- Authority
- JP
- Japan
- Prior art keywords
- case
- working
- inversion
- rail
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 17
- 230000007246 mechanism Effects 0.000 claims abstract description 9
- 239000008188 pellet Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15060884A JPS6130041A (ja) | 1984-07-20 | 1984-07-20 | 半導体装置組立装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15060884A JPS6130041A (ja) | 1984-07-20 | 1984-07-20 | 半導体装置組立装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6130041A true JPS6130041A (ja) | 1986-02-12 |
JPH0322698B2 JPH0322698B2 (enrdf_load_stackoverflow) | 1991-03-27 |
Family
ID=15500600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15060884A Granted JPS6130041A (ja) | 1984-07-20 | 1984-07-20 | 半導体装置組立装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6130041A (enrdf_load_stackoverflow) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5994614A (en) * | 1996-09-12 | 1999-11-30 | Uni-Charm Corporation | Absorbent article |
US6129717A (en) * | 1996-07-02 | 2000-10-10 | Uni-Charm Corporation | Absorbent article and method for producing the same |
US6156078A (en) * | 1991-09-16 | 2000-12-05 | Sgs-Thomson Microelectronics Sdn. Bhd. | Testing and finishing apparatus for integrated circuit package units |
US7425366B2 (en) | 2004-01-15 | 2008-09-16 | Kabushiki Kaisha Toshiba | Tape member or sheet member, and method of producing tape member or sheet member |
-
1984
- 1984-07-20 JP JP15060884A patent/JPS6130041A/ja active Granted
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6156078A (en) * | 1991-09-16 | 2000-12-05 | Sgs-Thomson Microelectronics Sdn. Bhd. | Testing and finishing apparatus for integrated circuit package units |
US6129717A (en) * | 1996-07-02 | 2000-10-10 | Uni-Charm Corporation | Absorbent article and method for producing the same |
US5994614A (en) * | 1996-09-12 | 1999-11-30 | Uni-Charm Corporation | Absorbent article |
US7425366B2 (en) | 2004-01-15 | 2008-09-16 | Kabushiki Kaisha Toshiba | Tape member or sheet member, and method of producing tape member or sheet member |
EP2204821A1 (en) * | 2004-01-15 | 2010-07-07 | Kabushi Kaisha Toshiba | Tape member or sheet member, and method of producing tape member or sheet member |
Also Published As
Publication number | Publication date |
---|---|
JPH0322698B2 (enrdf_load_stackoverflow) | 1991-03-27 |
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