JPS6130041A - Semiconductor device assembling apparatus - Google Patents

Abstract

PURPOSE:To prevent inclusion of foreign matter during the waiting condition by providing case inversion mechanisms between case supply portion and working portion and between the working portion and case housing portion and placing the case with its surface faced downward at the region other than the working portion. CONSTITUTION:A case 10 with its working surface facing downward within a case housing portion (c) reaches an inversion portion 1 through the rail 8. When the inversion portion 1 fixes a case 10 with vacuum absorption holes 2 and a slit of cam 4 on the line extended from the axis 3 enters the sensor 5 through rotation of motor 6 by the sensor, the motor stops and the case 10 is inverted, with the working surface placed upward as the case 9. After the working, the case 9 is inverted again at the inverting portion d' through the rail 7' and the case 9 is accommodated in the accommodating portion (a) as the case 10 facing downward. In this way, foreign matters to enter the case cavity are removed by dropping therefrom during the waiting condition and thereby highly reliable product can be obtained.

Description

[Detailed description of the invention] 〔Technical field〕 Regarding equipment.

[Prior art]

In conventional devices, semiconductor packages (hereinafter referred to as cases) are supplied and stored with the cases facing upward. This was thought to be natural since the work surface of the case (the surface where die bonding and wire bonding are performed) faces upward. However, when the case is facing upward, the silicon waste of semiconductor pellets (hereinafter abbreviated as die) generated inside the case cavity during work.
Wire scraps that get mixed in and foreign objects that get mixed in during the work waiting time remain as they are. Today, pattern wiring on the surface of a die is becoming finer and denser, and the distance between each wire connecting an electrode pad and an external lead is also becoming narrower.

Therefore, there is silicon debris from the die inside the cavity of the case.
The state in which wire crumbs and foreign matter are present causes short circuits between the die surfaces, wires, and tearing of the wires, and the quality and reliability of the product are significantly reduced.

[Purpose of the invention]

The object of the present invention is to provide a case supply section and a working section (die body/die/
By installing a case reversing mechanism between the working part and the wire bonding part) and between the working part and the case storage part, and placing the case face down in areas other than the working part, foreign objects will not get mixed in while waiting for work. It is highly reliable, prevents die scraps and wire scraps that are generated or mixed in during one operation, and removes foreign objects from the case cavity.
It is an object of the present invention to provide a semiconductor device assembly device that makes it possible to manufacture high-quality products.

[Structure of the invention]

According to the present invention, a semiconductor device assembly apparatus includes a die bonder for bonding a semiconductor pellet in a cavity of a semiconductor package, and a wire bonder for bonding the bonded semiconductor pellet O electrode pads and leads in a cavity of a case with a metal wire. In this method, a mechanism is added for inverting the semiconductor package while it is being transferred from the supply side to the storage side.
- A semiconductor device assembly apparatus with characteristics can be obtained.

〔Example〕

Next, embodiments of the present invention will be described using the drawings.

Fig. 1 is a block diagram of a reversing mechanism in one embodiment of the present invention, and Fig. 2 is a schematic diagram showing the structure of the present invention, in which a is a case supply section, C is a case storage section, and b is a working section (die (bonding part or wire bonding part), d and d/ are case reversing parts, and 7.7' and 8.8' are case transport rails.

In FIGS. 1 and 2, the cases 10 that are placed in the case storage section C (FIG. 2) facing downward (with the work surface facing downward) are taken out one by one and are shown on the top of the rail 8 by the case feeding mechanism. and reaches the reversing section 1.

The reversing section 1 has a vacuum suction port 2 (piping not shown), and a case 10 is fixed across the vacuum suction port 2 (piping not shown). When the case 10 enters the reversing part l, the motor 6 rotates by a sensor system (not shown), and the pickpocket on the extension of the motor shaft 3, the pickpocket on the tocam 4,
When the electric current enters the sensor 5, the motor 6 stops. (K), case 1° is rotated 180 degrees, that is, reversed, and becomes case 9 with the working surface facing upward.

After this, case 9 is placed in the work section (Fig. 2b) after the work is completed.
Passing through the rail 7' (Fig. 2), the case 1o is turned over again at the reversing part d/ (Fig. 2), and the housing part a (
Fig. 2) K is stored.

〔Effect of the invention〕

As described above, the present invention prevents foreign matter from entering the cavity in the case while waiting for work, and also allows die scraps and wire scraps generated or mixed during work to fall out from inside the case cavity. This has the effect of removing these foreign substances and making it possible to manufacture highly reliable and high quality semiconductor products.

[Brief explanation of drawings]

FIG. 1 is a block diagram of a reversing mechanism part of a mechanism according to an embodiment of the present invention, and FIG. 2 is a schematic diagram of the structure of an embodiment of the present invention. 1... Reversing part, 2... Vacuum suction port, 3
... Group, drive shaft, 4... Pickpocket, Tokam, 5...
...Sensor, 6...Motor, 7.8.7'
, 8'-... Conveyance rail, 9,1°...
・Case, a...Storage section, b...Working section, C...
...Supply part %d. d'...Reversing mechanism section.

Claims (1)

[Claims] A semiconductor device assembly apparatus including a die bonder for bonding a semiconductor pellet in a cavity of a semiconductor package, and a wire bonder for bonding an electrode pad of the bonded semiconductor pellet to a lead in a cavity of a case with a metal wire, wherein the semiconductor package is A semiconductor device assembly device characterized by adding a mechanism for reversing the device from the supply side to the storage side.