JPS61276396A - プリント配線板の製造方法 - Google Patents
プリント配線板の製造方法Info
- Publication number
- JPS61276396A JPS61276396A JP11846985A JP11846985A JPS61276396A JP S61276396 A JPS61276396 A JP S61276396A JP 11846985 A JP11846985 A JP 11846985A JP 11846985 A JP11846985 A JP 11846985A JP S61276396 A JPS61276396 A JP S61276396A
- Authority
- JP
- Japan
- Prior art keywords
- board
- main body
- printed wiring
- copper
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 238000007747 plating Methods 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 21
- 239000002699 waste material Substances 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 239000011889 copper foil Substances 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 8
- 239000000758 substrate Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11846985A JPS61276396A (ja) | 1985-05-31 | 1985-05-31 | プリント配線板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11846985A JPS61276396A (ja) | 1985-05-31 | 1985-05-31 | プリント配線板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61276396A true JPS61276396A (ja) | 1986-12-06 |
JPH0250637B2 JPH0250637B2 (enrdf_load_stackoverflow) | 1990-11-02 |
Family
ID=14737440
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11846985A Granted JPS61276396A (ja) | 1985-05-31 | 1985-05-31 | プリント配線板の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61276396A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7863662B2 (en) | 2005-12-22 | 2011-01-04 | Ngk Spark Plug Co., Ltd. | Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate |
JP2012160622A (ja) * | 2011-02-01 | 2012-08-23 | Ngk Spark Plug Co Ltd | 電子部品の製造方法 |
-
1985
- 1985-05-31 JP JP11846985A patent/JPS61276396A/ja active Granted
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7863662B2 (en) | 2005-12-22 | 2011-01-04 | Ngk Spark Plug Co., Ltd. | Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate |
US8304321B2 (en) | 2005-12-22 | 2012-11-06 | Ngk Spark Plug Co., Ltd. | Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate |
US8350306B2 (en) | 2005-12-22 | 2013-01-08 | Ngk Spark Plug Co., Ltd. | Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate |
US8697534B2 (en) | 2005-12-22 | 2014-04-15 | Ngk Spark Plug Co., Ltd. | Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate |
JP2012160622A (ja) * | 2011-02-01 | 2012-08-23 | Ngk Spark Plug Co Ltd | 電子部品の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0250637B2 (enrdf_load_stackoverflow) | 1990-11-02 |
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