JPS61264738A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JPS61264738A JPS61264738A JP10566785A JP10566785A JPS61264738A JP S61264738 A JPS61264738 A JP S61264738A JP 10566785 A JP10566785 A JP 10566785A JP 10566785 A JP10566785 A JP 10566785A JP S61264738 A JPS61264738 A JP S61264738A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- contact hole
- hole
- width
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000000463 material Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims description 10
- 239000012535 impurity Substances 0.000 abstract description 16
- 239000000758 substrate Substances 0.000 abstract description 11
- 230000010354 integration Effects 0.000 abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 238000006073 displacement reaction Methods 0.000 abstract 1
- 229920002120 photoresistant polymer Polymers 0.000 description 11
- 238000005530 etching Methods 0.000 description 8
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 8
- 230000007547 defect Effects 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10566785A JPS61264738A (ja) | 1985-05-17 | 1985-05-17 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10566785A JPS61264738A (ja) | 1985-05-17 | 1985-05-17 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61264738A true JPS61264738A (ja) | 1986-11-22 |
| JPH0334856B2 JPH0334856B2 (enrdf_load_stackoverflow) | 1991-05-24 |
Family
ID=14413787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10566785A Granted JPS61264738A (ja) | 1985-05-17 | 1985-05-17 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61264738A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0799246A (ja) * | 1992-12-02 | 1995-04-11 | Hyundai Electron Ind Co Ltd | 半導体装置のコンタクト及びその形成方法 |
-
1985
- 1985-05-17 JP JP10566785A patent/JPS61264738A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0799246A (ja) * | 1992-12-02 | 1995-04-11 | Hyundai Electron Ind Co Ltd | 半導体装置のコンタクト及びその形成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0334856B2 (enrdf_load_stackoverflow) | 1991-05-24 |
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