JPS61263229A - 半導体装置における樹脂封止装置 - Google Patents

半導体装置における樹脂封止装置

Info

Publication number
JPS61263229A
JPS61263229A JP60105450A JP10545085A JPS61263229A JP S61263229 A JPS61263229 A JP S61263229A JP 60105450 A JP60105450 A JP 60105450A JP 10545085 A JP10545085 A JP 10545085A JP S61263229 A JPS61263229 A JP S61263229A
Authority
JP
Japan
Prior art keywords
robot
lead frame
presses
molding
resin sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60105450A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0428133B2 (enExample
Inventor
Motoyoshi Ikemoto
池本　元良
Naoki Shimoda
直樹 下田
Minetoshi Yonezu
米津　▲れい▼俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YONEZU TAKASHI
Sumitomo Heavy Industries Ltd
Original Assignee
YONEZU TAKASHI
Sumitomo Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YONEZU TAKASHI, Sumitomo Heavy Industries Ltd filed Critical YONEZU TAKASHI
Priority to JP60105450A priority Critical patent/JPS61263229A/ja
Publication of JPS61263229A publication Critical patent/JPS61263229A/ja
Publication of JPH0428133B2 publication Critical patent/JPH0428133B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/01—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C45/1468—Plants therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP60105450A 1985-05-17 1985-05-17 半導体装置における樹脂封止装置 Granted JPS61263229A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60105450A JPS61263229A (ja) 1985-05-17 1985-05-17 半導体装置における樹脂封止装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60105450A JPS61263229A (ja) 1985-05-17 1985-05-17 半導体装置における樹脂封止装置

Publications (2)

Publication Number Publication Date
JPS61263229A true JPS61263229A (ja) 1986-11-21
JPH0428133B2 JPH0428133B2 (enExample) 1992-05-13

Family

ID=14407922

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60105450A Granted JPS61263229A (ja) 1985-05-17 1985-05-17 半導体装置における樹脂封止装置

Country Status (1)

Country Link
JP (1) JPS61263229A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL9401211A (nl) * 1993-07-22 1995-02-16 Towa Corp Werkwijze en inrichting voor het vormen van hars om elektronische delen af te dichten.
JP2011068104A (ja) * 2009-09-28 2011-04-07 Sumitomo Heavy Ind Ltd 封止装置及び封止方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL9401211A (nl) * 1993-07-22 1995-02-16 Towa Corp Werkwijze en inrichting voor het vormen van hars om elektronische delen af te dichten.
US5750059A (en) * 1993-07-22 1998-05-12 Towa Corporation Method of molding resin to seal electronic parts
JP2011068104A (ja) * 2009-09-28 2011-04-07 Sumitomo Heavy Ind Ltd 封止装置及び封止方法

Also Published As

Publication number Publication date
JPH0428133B2 (enExample) 1992-05-13

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