JPS61255848A - 導電性ポリアミド成形物及びその製造法 - Google Patents
導電性ポリアミド成形物及びその製造法Info
- Publication number
- JPS61255848A JPS61255848A JP60098298A JP9829885A JPS61255848A JP S61255848 A JPS61255848 A JP S61255848A JP 60098298 A JP60098298 A JP 60098298A JP 9829885 A JP9829885 A JP 9829885A JP S61255848 A JPS61255848 A JP S61255848A
- Authority
- JP
- Japan
- Prior art keywords
- polyamide molded
- film
- polyamide
- conductive
- molded article
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004952 Polyamide Substances 0.000 title claims description 39
- 229920002647 polyamide Polymers 0.000 title claims description 39
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 238000011282 treatment Methods 0.000 claims description 26
- 239000011248 coating agent Substances 0.000 claims description 22
- 238000000576 coating method Methods 0.000 claims description 22
- AQMRBJNRFUQADD-UHFFFAOYSA-N copper(I) sulfide Chemical compound [S-2].[Cu+].[Cu+] AQMRBJNRFUQADD-UHFFFAOYSA-N 0.000 claims description 19
- 125000003368 amide group Chemical group 0.000 claims description 12
- 230000004913 activation Effects 0.000 claims description 11
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 9
- 229910052717 sulfur Inorganic materials 0.000 claims description 9
- 239000011593 sulfur Substances 0.000 claims description 9
- 239000003638 chemical reducing agent Substances 0.000 claims description 8
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 5
- 229910001431 copper ion Inorganic materials 0.000 claims description 5
- 150000002366 halogen compounds Chemical class 0.000 claims description 3
- -1 phenol compound Chemical class 0.000 claims description 3
- 229910052736 halogen Inorganic materials 0.000 claims description 2
- 150000002367 halogens Chemical class 0.000 claims description 2
- 239000010408 film Substances 0.000 description 40
- 239000000243 solution Substances 0.000 description 15
- 229910000831 Steel Inorganic materials 0.000 description 11
- 239000010959 steel Substances 0.000 description 11
- 238000001994 activation Methods 0.000 description 10
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 9
- 150000002500 ions Chemical class 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 5
- 238000001878 scanning electron micrograph Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 229920002292 Nylon 6 Polymers 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000002932 luster Substances 0.000 description 3
- 150000002825 nitriles Chemical class 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 3
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 3
- 235000019345 sodium thiosulphate Nutrition 0.000 description 3
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 229910052740 iodine Inorganic materials 0.000 description 2
- 239000011630 iodine Substances 0.000 description 2
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 2
- HSZCZNFXUDYRKD-UHFFFAOYSA-M lithium iodide Chemical compound [Li+].[I-] HSZCZNFXUDYRKD-UHFFFAOYSA-M 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 2
- 125000000349 (Z)-3-carboxyprop-2-enoyl group Chemical group O=C([*])/C([H])=C([H])\C(O[H])=O 0.000 description 1
- LMYZQUNLYGJIHI-SPONXPENSA-N 4alpha-methyl-5alpha-cholest-7-en-3beta-ol Chemical compound C[C@@H]1[C@@H](O)CC[C@]2(C)[C@@H](CC[C@@]3([C@@H]([C@H](C)CCCC(C)C)CC[C@H]33)C)C3=CC[C@H]21 LMYZQUNLYGJIHI-SPONXPENSA-N 0.000 description 1
- 241000283690 Bos taurus Species 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- LMYZQUNLYGJIHI-UHFFFAOYSA-N Methostenol Natural products CC1C(O)CCC2(C)C(CCC3(C(C(C)CCCC(C)C)CCC33)C)C3=CCC21 LMYZQUNLYGJIHI-UHFFFAOYSA-N 0.000 description 1
- 241000566369 Palthis Species 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 1
- 229940076286 cupric acetate Drugs 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- FGRVOLIFQGXPCT-UHFFFAOYSA-L dipotassium;dioxido-oxo-sulfanylidene-$l^{6}-sulfane Chemical compound [K+].[K+].[O-]S([O-])(=O)=S FGRVOLIFQGXPCT-UHFFFAOYSA-L 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000001420 photoelectron spectroscopy Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- DPLVEEXVKBWGHE-UHFFFAOYSA-N potassium sulfide Chemical compound [S-2].[K+].[K+] DPLVEEXVKBWGHE-UHFFFAOYSA-N 0.000 description 1
- BHZRJJOHZFYXTO-UHFFFAOYSA-L potassium sulfite Chemical compound [K+].[K+].[O-]S([O-])=O BHZRJJOHZFYXTO-UHFFFAOYSA-L 0.000 description 1
- 235000019252 potassium sulphite Nutrition 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 235000009518 sodium iodide Nutrition 0.000 description 1
- 229910052979 sodium sulfide Inorganic materials 0.000 description 1
- GRVFOGOEDUUMBP-UHFFFAOYSA-N sodium sulfide (anhydrous) Chemical compound [Na+].[Na+].[S-2] GRVFOGOEDUUMBP-UHFFFAOYSA-N 0.000 description 1
- 235000010265 sodium sulphite Nutrition 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000005211 surface analysis Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- OMDXFCRSKHYDTM-UHFFFAOYSA-J thorium(4+);tetrabromide Chemical compound Br[Th](Br)(Br)Br OMDXFCRSKHYDTM-UHFFFAOYSA-J 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60098298A JPS61255848A (ja) | 1985-05-09 | 1985-05-09 | 導電性ポリアミド成形物及びその製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60098298A JPS61255848A (ja) | 1985-05-09 | 1985-05-09 | 導電性ポリアミド成形物及びその製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61255848A true JPS61255848A (ja) | 1986-11-13 |
| JPH0449859B2 JPH0449859B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-08-12 |
Family
ID=14216010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60098298A Granted JPS61255848A (ja) | 1985-05-09 | 1985-05-09 | 導電性ポリアミド成形物及びその製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61255848A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5297132A (en) * | 1986-10-29 | 1994-03-22 | Dai Nippon Insatsu Kabushiki Kaisha | Draw type optical recording medium |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60160197A (ja) * | 1984-01-30 | 1985-08-21 | 旭化成株式会社 | 電磁シ−ルド性を有する高分子成形体 |
| JPS60198004A (ja) * | 1984-03-21 | 1985-10-07 | 旭化成株式会社 | 導電性高分子材料の製造法 |
-
1985
- 1985-05-09 JP JP60098298A patent/JPS61255848A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60160197A (ja) * | 1984-01-30 | 1985-08-21 | 旭化成株式会社 | 電磁シ−ルド性を有する高分子成形体 |
| JPS60198004A (ja) * | 1984-03-21 | 1985-10-07 | 旭化成株式会社 | 導電性高分子材料の製造法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5297132A (en) * | 1986-10-29 | 1994-03-22 | Dai Nippon Insatsu Kabushiki Kaisha | Draw type optical recording medium |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0449859B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-08-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1139012A (en) | Method of preparing substrate surface for electroless plating and products produced thereby | |
| DE69305362T2 (de) | Verfahren zur stromlosen metallisierung von aramidfasern | |
| JPS5932553B2 (ja) | アルミニウム上に剥離可能な銅被覆を形成する方法 | |
| US3597266A (en) | Electroless nickel plating | |
| JPH07113156B2 (ja) | 耐食性金属製品の製造方法 | |
| US3058845A (en) | Process for metallizing polyacrylonitrile shaped article by treating with a water soluble metal salt and reducing the salt to the free metal | |
| US3282723A (en) | Electroless deposition and method of producing such electroless deposition | |
| JPS6096766A (ja) | 非電気的金属化用の基質類の活性化方法 | |
| JPS61255848A (ja) | 導電性ポリアミド成形物及びその製造法 | |
| US3498823A (en) | Electroless tin plating on electroless nickel | |
| JPH0445585B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| US3353986A (en) | Electroless deposition of cobalt-ironphosphorous magnetic material | |
| JP3437980B2 (ja) | 無電解パラジウム−ニッケルめっき浴およびこれを用いるめっき方法ならびにこの方法により得られるめっき製品 | |
| JPH03237A (ja) | 導電性ポリイミド成形物の製造法 | |
| JPS5949305B2 (ja) | 化学めつき前処理方法 | |
| CN113533473A (zh) | 含有金属-有机骨架的工作电极及其制备方法和应用 | |
| JPS6077151A (ja) | 金属被覆ガラス繊維を使用したｆｒｐ製品 | |
| JPS5989788A (ja) | 導電性を有する短繊維への電気めつき方法 | |
| US3496014A (en) | Method of controlling the magnetic characteristics of an electrolessly deposited magnetic film | |
| JPS5837616B2 (ja) | 磁気記録媒体の製造法 | |
| JPS6011105B2 (ja) | アルミニウムの無電流触媒析出方法 | |
| JPS58154105A (ja) | 導電性材料 | |
| JPS60208495A (ja) | カ−ボン材料に電気めつきを行なうための前処理方法 | |
| JPH0653687A (ja) | 電磁波シ−ルド材及びその製造方法 | |
| JPS6197469A (ja) | 導電性ポリエステル繊維の製造方法 |