JPS61224497A - 多層板の製造方法 - Google Patents

多層板の製造方法

Info

Publication number
JPS61224497A
JPS61224497A JP6589985A JP6589985A JPS61224497A JP S61224497 A JPS61224497 A JP S61224497A JP 6589985 A JP6589985 A JP 6589985A JP 6589985 A JP6589985 A JP 6589985A JP S61224497 A JPS61224497 A JP S61224497A
Authority
JP
Japan
Prior art keywords
board
inner layer
layer printed
multilayer board
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6589985A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0457119B2 (enrdf_load_stackoverflow
Inventor
有路　克則
堤　善朋
正光 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Corp filed Critical Toshiba Chemical Corp
Priority to JP6589985A priority Critical patent/JPS61224497A/ja
Publication of JPS61224497A publication Critical patent/JPS61224497A/ja
Publication of JPH0457119B2 publication Critical patent/JPH0457119B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
JP6589985A 1985-03-29 1985-03-29 多層板の製造方法 Granted JPS61224497A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6589985A JPS61224497A (ja) 1985-03-29 1985-03-29 多層板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6589985A JPS61224497A (ja) 1985-03-29 1985-03-29 多層板の製造方法

Publications (2)

Publication Number Publication Date
JPS61224497A true JPS61224497A (ja) 1986-10-06
JPH0457119B2 JPH0457119B2 (enrdf_load_stackoverflow) 1992-09-10

Family

ID=13300269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6589985A Granted JPS61224497A (ja) 1985-03-29 1985-03-29 多層板の製造方法

Country Status (1)

Country Link
JP (1) JPS61224497A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61256696A (ja) * 1985-05-08 1986-11-14 松下電工株式会社 多層印刷配線板の製造方法
US4918812A (en) * 1988-06-29 1990-04-24 International Business Machines Corporation Processing of cores for circuit boards or cards
JP2006303387A (ja) * 2005-04-25 2006-11-02 Mitsubishi Electric Corp プリント配線板
JP2009181985A (ja) * 2008-01-29 2009-08-13 Sharp Corp 多層プリント配線板の製造方法および仮止め装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61256696A (ja) * 1985-05-08 1986-11-14 松下電工株式会社 多層印刷配線板の製造方法
US4918812A (en) * 1988-06-29 1990-04-24 International Business Machines Corporation Processing of cores for circuit boards or cards
JP2006303387A (ja) * 2005-04-25 2006-11-02 Mitsubishi Electric Corp プリント配線板
JP2009181985A (ja) * 2008-01-29 2009-08-13 Sharp Corp 多層プリント配線板の製造方法および仮止め装置

Also Published As

Publication number Publication date
JPH0457119B2 (enrdf_load_stackoverflow) 1992-09-10

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees