JPH0564098B2 - - Google Patents
Info
- Publication number
- JPH0564098B2 JPH0564098B2 JP61015373A JP1537386A JPH0564098B2 JP H0564098 B2 JPH0564098 B2 JP H0564098B2 JP 61015373 A JP61015373 A JP 61015373A JP 1537386 A JP1537386 A JP 1537386A JP H0564098 B2 JPH0564098 B2 JP H0564098B2
- Authority
- JP
- Japan
- Prior art keywords
- inner layer
- board
- circuit pattern
- prepreg
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 239000011889 copper foil Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 2
- 239000011521 glass Substances 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61015373A JPS62173236A (ja) | 1986-01-27 | 1986-01-27 | 多層板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61015373A JPS62173236A (ja) | 1986-01-27 | 1986-01-27 | 多層板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62173236A JPS62173236A (ja) | 1987-07-30 |
JPH0564098B2 true JPH0564098B2 (enrdf_load_stackoverflow) | 1993-09-13 |
Family
ID=11886973
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61015373A Granted JPS62173236A (ja) | 1986-01-27 | 1986-01-27 | 多層板の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62173236A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105291549B (zh) * | 2015-11-06 | 2018-03-13 | 南京双威生物医学科技有限公司 | 一种多膜热合装置 |
-
1986
- 1986-01-27 JP JP61015373A patent/JPS62173236A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS62173236A (ja) | 1987-07-30 |
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