JPH0457119B2 - - Google Patents
Info
- Publication number
- JPH0457119B2 JPH0457119B2 JP6589985A JP6589985A JPH0457119B2 JP H0457119 B2 JPH0457119 B2 JP H0457119B2 JP 6589985 A JP6589985 A JP 6589985A JP 6589985 A JP6589985 A JP 6589985A JP H0457119 B2 JPH0457119 B2 JP H0457119B2
- Authority
- JP
- Japan
- Prior art keywords
- inner layer
- layer printed
- board
- multilayer board
- printed boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- -1 Cyanoacrylic acid ester Chemical class 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6589985A JPS61224497A (ja) | 1985-03-29 | 1985-03-29 | 多層板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6589985A JPS61224497A (ja) | 1985-03-29 | 1985-03-29 | 多層板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61224497A JPS61224497A (ja) | 1986-10-06 |
| JPH0457119B2 true JPH0457119B2 (enrdf_load_stackoverflow) | 1992-09-10 |
Family
ID=13300269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6589985A Granted JPS61224497A (ja) | 1985-03-29 | 1985-03-29 | 多層板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61224497A (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61256696A (ja) * | 1985-05-08 | 1986-11-14 | 松下電工株式会社 | 多層印刷配線板の製造方法 |
| US4918812A (en) * | 1988-06-29 | 1990-04-24 | International Business Machines Corporation | Processing of cores for circuit boards or cards |
| JP4591181B2 (ja) * | 2005-04-25 | 2010-12-01 | 三菱電機株式会社 | プリント配線板 |
| JP2009181985A (ja) * | 2008-01-29 | 2009-08-13 | Sharp Corp | 多層プリント配線板の製造方法および仮止め装置 |
-
1985
- 1985-03-29 JP JP6589985A patent/JPS61224497A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61224497A (ja) | 1986-10-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |