JPS61193474A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS61193474A
JPS61193474A JP60033746A JP3374685A JPS61193474A JP S61193474 A JPS61193474 A JP S61193474A JP 60033746 A JP60033746 A JP 60033746A JP 3374685 A JP3374685 A JP 3374685A JP S61193474 A JPS61193474 A JP S61193474A
Authority
JP
Japan
Prior art keywords
posts
row
rows
another
post
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60033746A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0446451B2 (cg-RX-API-DMAC10.html
Inventor
Nobuhisa Ishida
暢久 石田
Hideo Taniguchi
秀夫 谷口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP60033746A priority Critical patent/JPS61193474A/ja
Publication of JPS61193474A publication Critical patent/JPS61193474A/ja
Publication of JPH0446451B2 publication Critical patent/JPH0446451B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H10W70/60—
    • H10W70/611—
    • H10W72/075—
    • H10W72/07551—
    • H10W72/07554—
    • H10W72/50—
    • H10W72/5445—
    • H10W72/547—
    • H10W72/59—
    • H10W72/932—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
JP60033746A 1985-02-21 1985-02-21 半導体装置 Granted JPS61193474A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60033746A JPS61193474A (ja) 1985-02-21 1985-02-21 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60033746A JPS61193474A (ja) 1985-02-21 1985-02-21 半導体装置

Publications (2)

Publication Number Publication Date
JPS61193474A true JPS61193474A (ja) 1986-08-27
JPH0446451B2 JPH0446451B2 (cg-RX-API-DMAC10.html) 1992-07-30

Family

ID=12394977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60033746A Granted JPS61193474A (ja) 1985-02-21 1985-02-21 半導体装置

Country Status (1)

Country Link
JP (1) JPS61193474A (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0382445A3 (en) * 1989-02-10 1991-04-17 Honeywell Inc. High density bond pad design
US5895977A (en) * 1996-08-08 1999-04-20 Intel Corporation Bond pad functional layout on die to improve package manufacturability and assembly
JP2007103423A (ja) * 2005-09-30 2007-04-19 Renesas Technology Corp 半導体装置及びその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58107844U (ja) * 1982-01-13 1983-07-22 株式会社東芝 サ−マルヘツド
JPS594131A (ja) * 1982-06-30 1984-01-10 Fujitsu Ltd 半導体パツケ−ジ
JPS5914652A (ja) * 1982-07-16 1984-01-25 Nec Corp 半導体容器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58107844U (ja) * 1982-01-13 1983-07-22 株式会社東芝 サ−マルヘツド
JPS594131A (ja) * 1982-06-30 1984-01-10 Fujitsu Ltd 半導体パツケ−ジ
JPS5914652A (ja) * 1982-07-16 1984-01-25 Nec Corp 半導体容器

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0382445A3 (en) * 1989-02-10 1991-04-17 Honeywell Inc. High density bond pad design
US5895977A (en) * 1996-08-08 1999-04-20 Intel Corporation Bond pad functional layout on die to improve package manufacturability and assembly
JP2007103423A (ja) * 2005-09-30 2007-04-19 Renesas Technology Corp 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JPH0446451B2 (cg-RX-API-DMAC10.html) 1992-07-30

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