JPS58107844U - サ−マルヘツド - Google Patents
サ−マルヘツドInfo
- Publication number
- JPS58107844U JPS58107844U JP1982003124U JP312482U JPS58107844U JP S58107844 U JPS58107844 U JP S58107844U JP 1982003124 U JP1982003124 U JP 1982003124U JP 312482 U JP312482 U JP 312482U JP S58107844 U JPS58107844 U JP S58107844U
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- element array
- backflow prevention
- heat sink
- prevention element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/494—Connecting portions
- H01L2224/4943—Connecting portions the connecting portions being staggered
- H01L2224/49431—Connecting portions the connecting portions being staggered on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/494—Connecting portions
- H01L2224/4943—Connecting portions the connecting portions being staggered
- H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electronic Switches (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図及び第2図はサーマルヘッドに形成する逆流防止
素子アレイやマトリックス回路の回路構成(アノード・
コモンΦタイプとアイソレーショ −ン・タイプ)を示
す回路図、第3図は第1図に対応した従来のサーマルベ
ッドを示す平面図、第4図は第3図のA−A’線で切断
し矢印方向に見た断面図、第5図はこの考案の一実施例
に係るサーマルヘッドを示す断面図、第6図及び第7図
はこの考案の他の実施例を示す断面図である。 1・・・・・・発熱抵抗体、2・・・・・・逆流防止素
子アレイ、3・・・・・・マトリックス回路、4・・・
・・・共通電極、5・・・・・・個別電極、6・・・・
・・ヒートシンク、7・・・・・・第1の、基板、・8
・・・・・・第2の基板、9,10・・・・・・リード
、11.12・・・・・・ワイヤ、13・・・・・・凸
部。。 第2図 第3図
素子アレイやマトリックス回路の回路構成(アノード・
コモンΦタイプとアイソレーショ −ン・タイプ)を示
す回路図、第3図は第1図に対応した従来のサーマルベ
ッドを示す平面図、第4図は第3図のA−A’線で切断
し矢印方向に見た断面図、第5図はこの考案の一実施例
に係るサーマルヘッドを示す断面図、第6図及び第7図
はこの考案の他の実施例を示す断面図である。 1・・・・・・発熱抵抗体、2・・・・・・逆流防止素
子アレイ、3・・・・・・マトリックス回路、4・・・
・・・共通電極、5・・・・・・個別電極、6・・・・
・・ヒートシンク、7・・・・・・第1の、基板、・8
・・・・・・第2の基板、9,10・・・・・・リード
、11.12・・・・・・ワイヤ、13・・・・・・凸
部。。 第2図 第3図
Claims (2)
- (1) 駿−トシンク上に設けられ複数の発熱抵抗体
及びそれに続くリードを有する第1の基板と、前記ヒー
トシンク上に設けられ÷トリックス回路及びそれに続(
複数のリードを有する第2の基板と、前記各リードにワ
イヤによりボンディング接続された逆流防止素子アレイ
とからなるサーマルヘッドにおいて、 前記各基板の表面と前記逆流防止素子アレイの表面とを
略一致させたことを特徴とするサーマルヘッド。 - (2)前記ヒートシンクに凸部を設け、この凸部に前記
逆流防止素子アレイを固着した実用新案登録請求の範囲
第1項記載のサーマルヘッド。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982003124U JPS58107844U (ja) | 1982-01-13 | 1982-01-13 | サ−マルヘツド |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982003124U JPS58107844U (ja) | 1982-01-13 | 1982-01-13 | サ−マルヘツド |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58107844U true JPS58107844U (ja) | 1983-07-22 |
Family
ID=30016073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1982003124U Pending JPS58107844U (ja) | 1982-01-13 | 1982-01-13 | サ−マルヘツド |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58107844U (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61193474A (ja) * | 1985-02-21 | 1986-08-27 | Rohm Co Ltd | 半導体装置 |
JPH0582550U (ja) * | 1992-04-14 | 1993-11-09 | セイコー電子工業株式会社 | サーマルヘッド基板 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52155542A (en) * | 1976-06-18 | 1977-12-24 | Nec Corp | Thermal head device |
JPS5324846A (en) * | 1976-08-18 | 1978-03-08 | Matsushita Electric Ind Co Ltd | Thermal head device |
-
1982
- 1982-01-13 JP JP1982003124U patent/JPS58107844U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52155542A (en) * | 1976-06-18 | 1977-12-24 | Nec Corp | Thermal head device |
JPS5324846A (en) * | 1976-08-18 | 1978-03-08 | Matsushita Electric Ind Co Ltd | Thermal head device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61193474A (ja) * | 1985-02-21 | 1986-08-27 | Rohm Co Ltd | 半導体装置 |
JPH0582550U (ja) * | 1992-04-14 | 1993-11-09 | セイコー電子工業株式会社 | サーマルヘッド基板 |
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