JPH0446451B2 - - Google Patents

Info

Publication number
JPH0446451B2
JPH0446451B2 JP60033746A JP3374685A JPH0446451B2 JP H0446451 B2 JPH0446451 B2 JP H0446451B2 JP 60033746 A JP60033746 A JP 60033746A JP 3374685 A JP3374685 A JP 3374685A JP H0446451 B2 JPH0446451 B2 JP H0446451B2
Authority
JP
Japan
Prior art keywords
posts
row
post
semiconductor element
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60033746A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61193474A (ja
Inventor
Nobuhisa Ishida
Hideo Taniguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP60033746A priority Critical patent/JPS61193474A/ja
Publication of JPS61193474A publication Critical patent/JPS61193474A/ja
Publication of JPH0446451B2 publication Critical patent/JPH0446451B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H10W70/60—
    • H10W70/611—
    • H10W72/075—
    • H10W72/07551—
    • H10W72/07554—
    • H10W72/50—
    • H10W72/5445—
    • H10W72/547—
    • H10W72/59—
    • H10W72/932—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
JP60033746A 1985-02-21 1985-02-21 半導体装置 Granted JPS61193474A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60033746A JPS61193474A (ja) 1985-02-21 1985-02-21 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60033746A JPS61193474A (ja) 1985-02-21 1985-02-21 半導体装置

Publications (2)

Publication Number Publication Date
JPS61193474A JPS61193474A (ja) 1986-08-27
JPH0446451B2 true JPH0446451B2 (cg-RX-API-DMAC10.html) 1992-07-30

Family

ID=12394977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60033746A Granted JPS61193474A (ja) 1985-02-21 1985-02-21 半導体装置

Country Status (1)

Country Link
JP (1) JPS61193474A (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0382445A3 (en) * 1989-02-10 1991-04-17 Honeywell Inc. High density bond pad design
US5895977A (en) * 1996-08-08 1999-04-20 Intel Corporation Bond pad functional layout on die to improve package manufacturability and assembly
JP2007103423A (ja) * 2005-09-30 2007-04-19 Renesas Technology Corp 半導体装置及びその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58107844U (ja) * 1982-01-13 1983-07-22 株式会社東芝 サ−マルヘツド
JPS594131A (ja) * 1982-06-30 1984-01-10 Fujitsu Ltd 半導体パツケ−ジ
JPS5914652A (ja) * 1982-07-16 1984-01-25 Nec Corp 半導体容器

Also Published As

Publication number Publication date
JPS61193474A (ja) 1986-08-27

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees