JPH0546976B2 - - Google Patents

Info

Publication number
JPH0546976B2
JPH0546976B2 JP61302519A JP30251986A JPH0546976B2 JP H0546976 B2 JPH0546976 B2 JP H0546976B2 JP 61302519 A JP61302519 A JP 61302519A JP 30251986 A JP30251986 A JP 30251986A JP H0546976 B2 JPH0546976 B2 JP H0546976B2
Authority
JP
Japan
Prior art keywords
thin metal
bonding
wire
package
bonding pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61302519A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63153832A (ja
Inventor
Kyoshi Futagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP61302519A priority Critical patent/JPS63153832A/ja
Publication of JPS63153832A publication Critical patent/JPS63153832A/ja
Publication of JPH0546976B2 publication Critical patent/JPH0546976B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H10W72/5449—
    • H10W72/932—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP61302519A 1986-12-17 1986-12-17 半導体装置のワイヤボンデイング構造 Granted JPS63153832A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61302519A JPS63153832A (ja) 1986-12-17 1986-12-17 半導体装置のワイヤボンデイング構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61302519A JPS63153832A (ja) 1986-12-17 1986-12-17 半導体装置のワイヤボンデイング構造

Publications (2)

Publication Number Publication Date
JPS63153832A JPS63153832A (ja) 1988-06-27
JPH0546976B2 true JPH0546976B2 (cg-RX-API-DMAC10.html) 1993-07-15

Family

ID=17909940

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61302519A Granted JPS63153832A (ja) 1986-12-17 1986-12-17 半導体装置のワイヤボンデイング構造

Country Status (1)

Country Link
JP (1) JPS63153832A (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03208354A (ja) * 1990-01-10 1991-09-11 Mitsubishi Electric Corp 半導体装置およびその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6232549U (cg-RX-API-DMAC10.html) * 1985-08-09 1987-02-26

Also Published As

Publication number Publication date
JPS63153832A (ja) 1988-06-27

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