JPS61160924A - 半導体薄膜結晶層の製造方法 - Google Patents
半導体薄膜結晶層の製造方法Info
- Publication number
- JPS61160924A JPS61160924A JP87085A JP87085A JPS61160924A JP S61160924 A JPS61160924 A JP S61160924A JP 87085 A JP87085 A JP 87085A JP 87085 A JP87085 A JP 87085A JP S61160924 A JPS61160924 A JP S61160924A
- Authority
- JP
- Japan
- Prior art keywords
- film
- thin film
- tungsten
- insulating film
- titanium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010409 thin film Substances 0.000 title claims description 26
- 239000013078 crystal Substances 0.000 title claims description 22
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000004065 semiconductor Substances 0.000 title claims description 15
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 27
- 239000010937 tungsten Substances 0.000 claims abstract description 27
- 238000000137 annealing Methods 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 24
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 24
- 239000010936 titanium Substances 0.000 claims abstract description 24
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 23
- 238000010894 electron beam technology Methods 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 8
- 239000010408 film Substances 0.000 claims description 72
- 238000000034 method Methods 0.000 claims description 24
- 238000002844 melting Methods 0.000 claims description 21
- 230000008018 melting Effects 0.000 claims description 20
- 229910052710 silicon Inorganic materials 0.000 claims description 18
- 239000010703 silicon Substances 0.000 claims description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 17
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 239000011733 molybdenum Substances 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052814 silicon oxide Inorganic materials 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 21
- 238000000407 epitaxy Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 229910001069 Ti alloy Inorganic materials 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- JVJQPDTXIALXOG-UHFFFAOYSA-N nitryl fluoride Chemical compound [O-][N+](F)=O JVJQPDTXIALXOG-UHFFFAOYSA-N 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 150000003608 titanium Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02689—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using particle beams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02488—Insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Recrystallisation Techniques (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP87085A JPS61160924A (ja) | 1985-01-09 | 1985-01-09 | 半導体薄膜結晶層の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP87085A JPS61160924A (ja) | 1985-01-09 | 1985-01-09 | 半導体薄膜結晶層の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61160924A true JPS61160924A (ja) | 1986-07-21 |
JPH0236054B2 JPH0236054B2 (enrdf_load_stackoverflow) | 1990-08-15 |
Family
ID=11485702
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP87085A Granted JPS61160924A (ja) | 1985-01-09 | 1985-01-09 | 半導体薄膜結晶層の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61160924A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6450410A (en) * | 1987-08-21 | 1989-02-27 | Agency Ind Science Techn | Manufacture of semiconductor single crystal layer |
JP2007042803A (ja) * | 2005-08-02 | 2007-02-15 | Honda Motor Co Ltd | イオン注入マスクおよびその製造方法、並びにイオン注入マスクを用いた炭化珪素半導体装置およびその製造方法 |
KR101161456B1 (ko) * | 2005-08-02 | 2012-07-02 | 신덴겐코교 가부시키가이샤 | 이온 주입 마스크 및 그 제조 방법과, 이온 주입 마스크를이용한 탄화규소 반도체 장치 및 그 제조 방법 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5516425A (en) * | 1978-07-21 | 1980-02-05 | Toshiba Corp | Semiconductor device |
JPS5671954A (en) * | 1979-11-19 | 1981-06-15 | Seiko Epson Corp | Mos type semiconductor device |
JPS58139423A (ja) * | 1982-02-15 | 1983-08-18 | Fujitsu Ltd | ラテラルエピタキシヤル成長法 |
-
1985
- 1985-01-09 JP JP87085A patent/JPS61160924A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5516425A (en) * | 1978-07-21 | 1980-02-05 | Toshiba Corp | Semiconductor device |
JPS5671954A (en) * | 1979-11-19 | 1981-06-15 | Seiko Epson Corp | Mos type semiconductor device |
JPS58139423A (ja) * | 1982-02-15 | 1983-08-18 | Fujitsu Ltd | ラテラルエピタキシヤル成長法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6450410A (en) * | 1987-08-21 | 1989-02-27 | Agency Ind Science Techn | Manufacture of semiconductor single crystal layer |
JP2007042803A (ja) * | 2005-08-02 | 2007-02-15 | Honda Motor Co Ltd | イオン注入マスクおよびその製造方法、並びにイオン注入マスクを用いた炭化珪素半導体装置およびその製造方法 |
KR101161456B1 (ko) * | 2005-08-02 | 2012-07-02 | 신덴겐코교 가부시키가이샤 | 이온 주입 마스크 및 그 제조 방법과, 이온 주입 마스크를이용한 탄화규소 반도체 장치 및 그 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
JPH0236054B2 (enrdf_load_stackoverflow) | 1990-08-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |