JPS61143466A - 半導体封止用エポキシ樹脂組成物 - Google Patents
半導体封止用エポキシ樹脂組成物Info
- Publication number
- JPS61143466A JPS61143466A JP26538384A JP26538384A JPS61143466A JP S61143466 A JPS61143466 A JP S61143466A JP 26538384 A JP26538384 A JP 26538384A JP 26538384 A JP26538384 A JP 26538384A JP S61143466 A JPS61143466 A JP S61143466A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- filler
- resin composition
- quartz powder
- surface area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 17
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 16
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000000945 filler Substances 0.000 claims abstract description 10
- 239000000843 powder Substances 0.000 claims abstract description 10
- 239000010453 quartz Substances 0.000 claims abstract description 6
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 5
- 239000002245 particle Substances 0.000 claims description 17
- 229920003986 novolac Polymers 0.000 abstract description 8
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 abstract description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 abstract description 2
- 229930003836 cresol Natural products 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000007423 decrease Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000004438 BET method Methods 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- 239000005046 Chlorosilane Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- -1 polysiloxane Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26538384A JPS61143466A (ja) | 1984-12-18 | 1984-12-18 | 半導体封止用エポキシ樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26538384A JPS61143466A (ja) | 1984-12-18 | 1984-12-18 | 半導体封止用エポキシ樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61143466A true JPS61143466A (ja) | 1986-07-01 |
| JPH0242383B2 JPH0242383B2 (https=) | 1990-09-21 |
Family
ID=17416413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26538384A Granted JPS61143466A (ja) | 1984-12-18 | 1984-12-18 | 半導体封止用エポキシ樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61143466A (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01245014A (ja) * | 1988-03-25 | 1989-09-29 | Toray Ind Inc | 半導体封止用樹脂組成物 |
| JPH0232115A (ja) * | 1988-07-22 | 1990-02-01 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
| DE4003842A1 (de) * | 1989-02-09 | 1990-08-16 | Shinetsu Chemical Co | Epoxidharzmassen zum einkapseln von halbleitern |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3838094A (en) * | 1973-04-23 | 1974-09-24 | Nat Semiconductor Corp | Molding composition and molded product |
| JPS539297A (en) * | 1976-07-12 | 1978-01-27 | Nat Semiconductor Corp | Modified silica and method of making same |
| JPS56110248A (en) * | 1980-02-06 | 1981-09-01 | Nitto Electric Ind Co Ltd | Manufacture of filler for semiconductor sealing resin |
| JPS57195117A (en) * | 1981-05-27 | 1982-11-30 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and its preparation |
| JPS57212225A (en) * | 1981-06-24 | 1982-12-27 | Nitto Electric Ind Co Ltd | Epoxy resin composition for encapsulation of semiconductor |
| JPS58127354A (ja) * | 1982-01-25 | 1983-07-29 | Shin Etsu Chem Co Ltd | 半導体素子封止用樹脂組成物 |
| JPS60115641A (ja) * | 1983-11-25 | 1985-06-22 | Denki Kagaku Kogyo Kk | 封止樹脂用充填剤及びその組成物 |
-
1984
- 1984-12-18 JP JP26538384A patent/JPS61143466A/ja active Granted
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3838094A (en) * | 1973-04-23 | 1974-09-24 | Nat Semiconductor Corp | Molding composition and molded product |
| JPS539297A (en) * | 1976-07-12 | 1978-01-27 | Nat Semiconductor Corp | Modified silica and method of making same |
| JPS56110248A (en) * | 1980-02-06 | 1981-09-01 | Nitto Electric Ind Co Ltd | Manufacture of filler for semiconductor sealing resin |
| JPS57195117A (en) * | 1981-05-27 | 1982-11-30 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and its preparation |
| JPS57212225A (en) * | 1981-06-24 | 1982-12-27 | Nitto Electric Ind Co Ltd | Epoxy resin composition for encapsulation of semiconductor |
| JPS58127354A (ja) * | 1982-01-25 | 1983-07-29 | Shin Etsu Chem Co Ltd | 半導体素子封止用樹脂組成物 |
| JPS60115641A (ja) * | 1983-11-25 | 1985-06-22 | Denki Kagaku Kogyo Kk | 封止樹脂用充填剤及びその組成物 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01245014A (ja) * | 1988-03-25 | 1989-09-29 | Toray Ind Inc | 半導体封止用樹脂組成物 |
| JPH0232115A (ja) * | 1988-07-22 | 1990-02-01 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
| DE4003842A1 (de) * | 1989-02-09 | 1990-08-16 | Shinetsu Chemical Co | Epoxidharzmassen zum einkapseln von halbleitern |
| US5137940A (en) * | 1989-02-09 | 1992-08-11 | Shin-Etsu Chemical Co., Ltd. | Semiconductor encapsulating epoxy resin compositions |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0242383B2 (https=) | 1990-09-21 |
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