JPH0242383B2 - - Google Patents

Info

Publication number
JPH0242383B2
JPH0242383B2 JP59265383A JP26538384A JPH0242383B2 JP H0242383 B2 JPH0242383 B2 JP H0242383B2 JP 59265383 A JP59265383 A JP 59265383A JP 26538384 A JP26538384 A JP 26538384A JP H0242383 B2 JPH0242383 B2 JP H0242383B2
Authority
JP
Japan
Prior art keywords
epoxy resin
average particle
surface area
specific surface
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59265383A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61143466A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP26538384A priority Critical patent/JPS61143466A/ja
Publication of JPS61143466A publication Critical patent/JPS61143466A/ja
Publication of JPH0242383B2 publication Critical patent/JPH0242383B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP26538384A 1984-12-18 1984-12-18 半導体封止用エポキシ樹脂組成物 Granted JPS61143466A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26538384A JPS61143466A (ja) 1984-12-18 1984-12-18 半導体封止用エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26538384A JPS61143466A (ja) 1984-12-18 1984-12-18 半導体封止用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS61143466A JPS61143466A (ja) 1986-07-01
JPH0242383B2 true JPH0242383B2 (https=) 1990-09-21

Family

ID=17416413

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26538384A Granted JPS61143466A (ja) 1984-12-18 1984-12-18 半導体封止用エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS61143466A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2600258B2 (ja) * 1988-03-25 1997-04-16 東レ株式会社 半導体封止用樹脂組成物
JPH0232115A (ja) * 1988-07-22 1990-02-01 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
DE4003842C2 (de) * 1989-02-09 1997-06-05 Shinetsu Chemical Co Epoxidharzmassen zum Einkapseln von Halbleitern, enthaltend kugelförmiges Siliciumdioxid

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3838094A (en) * 1973-04-23 1974-09-24 Nat Semiconductor Corp Molding composition and molded product
DE2721294A1 (de) * 1976-07-12 1978-01-19 Nat Semiconductor Corp Oberflaechenbehandelter fuellstoff aus kieselerde mit hydrophobem verhalten
JPS56110248A (en) * 1980-02-06 1981-09-01 Nitto Electric Ind Co Ltd Manufacture of filler for semiconductor sealing resin
JPS57195117A (en) * 1981-05-27 1982-11-30 Sumitomo Bakelite Co Ltd Epoxy resin composition and its preparation
JPS57212225A (en) * 1981-06-24 1982-12-27 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS58127354A (ja) * 1982-01-25 1983-07-29 Shin Etsu Chem Co Ltd 半導体素子封止用樹脂組成物
JPS60115641A (ja) * 1983-11-25 1985-06-22 Denki Kagaku Kogyo Kk 封止樹脂用充填剤及びその組成物

Also Published As

Publication number Publication date
JPS61143466A (ja) 1986-07-01

Similar Documents

Publication Publication Date Title
JP3611066B2 (ja) 無機質充填剤及びエポキシ樹脂組成物の製造方法
JPH0375570B2 (https=)
KR100251853B1 (ko) 에폭시수지조성물및이것으로캡슐화된반도체장치
JP3821173B2 (ja) エポキシ樹脂組成物
JPH1060161A (ja) 改良窒化ホウ素組成物及びポリマーベースの高熱伝導率成形コンパウンド
JPS6157347B2 (https=)
JP5340558B2 (ja) 半導体封止用エポキシ樹脂組成物およびそれを用いて得られる半導体装置
JPH0329259B2 (https=)
JPS5922955A (ja) 半導体封止用樹脂組成物
JPH0242383B2 (https=)
JP2957226B2 (ja) 電気部品及び電子部品用の注型材料
JPS6296568A (ja) 半導体封止用樹脂組成物
JP2000319633A (ja) エポキシ樹脂系封止材料用シリカ系充填材
JP3445707B2 (ja) シリカ質フィラー及びその製法
JP4618056B2 (ja) 半導体封止用エポキシ樹脂組成物及びその製造方法
JPS6296567A (ja) 半導体封止用エポキシ樹脂組成物
JP4244259B2 (ja) 非晶質シリカ粉末及び樹脂組成物
JP2002201288A (ja) 半導体封止用エポキシ樹脂組成物の製造方法
JPH02145416A (ja) 溶融球状シリカ及びこれを用いた封止用樹脂組成物
JPS6296569A (ja) 半導体封止用樹脂組成物
JPH0716946B2 (ja) エポキシ樹脂成形材料の製造方法
JP2539482B2 (ja) 半導体封止用エポキシ樹脂組成物
JPS61215615A (ja) 半導体封止用樹脂組成物
JPH07103263B2 (ja) 封止樹脂充填用シリカ
JP2505485B2 (ja) 半導体樹脂封止用添加剤