JPS61135129A - 樹脂封止型半導体装置の製造方法 - Google Patents

樹脂封止型半導体装置の製造方法

Info

Publication number
JPS61135129A
JPS61135129A JP59257087A JP25708784A JPS61135129A JP S61135129 A JPS61135129 A JP S61135129A JP 59257087 A JP59257087 A JP 59257087A JP 25708784 A JP25708784 A JP 25708784A JP S61135129 A JPS61135129 A JP S61135129A
Authority
JP
Japan
Prior art keywords
resin
support plate
mold
resin body
supporting plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59257087A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0213932B2 (cg-RX-API-DMAC10.html
Inventor
Minehide Totokawa
都外川　峯秀
Takaaki Yokoyama
隆昭 横山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP59257087A priority Critical patent/JPS61135129A/ja
Publication of JPS61135129A publication Critical patent/JPS61135129A/ja
Publication of JPH0213932B2 publication Critical patent/JPH0213932B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/01—
    • H10W72/01515—
    • H10W72/075—
    • H10W74/00—
    • H10W74/10—
    • H10W90/756—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59257087A 1984-12-05 1984-12-05 樹脂封止型半導体装置の製造方法 Granted JPS61135129A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59257087A JPS61135129A (ja) 1984-12-05 1984-12-05 樹脂封止型半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59257087A JPS61135129A (ja) 1984-12-05 1984-12-05 樹脂封止型半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS61135129A true JPS61135129A (ja) 1986-06-23
JPH0213932B2 JPH0213932B2 (cg-RX-API-DMAC10.html) 1990-04-05

Family

ID=17301560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59257087A Granted JPS61135129A (ja) 1984-12-05 1984-12-05 樹脂封止型半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS61135129A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0394432A (ja) * 1989-06-30 1991-04-19 Sanken Electric Co Ltd 樹脂封止型電子部品の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0394432A (ja) * 1989-06-30 1991-04-19 Sanken Electric Co Ltd 樹脂封止型電子部品の製造方法

Also Published As

Publication number Publication date
JPH0213932B2 (cg-RX-API-DMAC10.html) 1990-04-05

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees