JPH0446456B2 - - Google Patents

Info

Publication number
JPH0446456B2
JPH0446456B2 JP59125163A JP12516384A JPH0446456B2 JP H0446456 B2 JPH0446456 B2 JP H0446456B2 JP 59125163 A JP59125163 A JP 59125163A JP 12516384 A JP12516384 A JP 12516384A JP H0446456 B2 JPH0446456 B2 JP H0446456B2
Authority
JP
Japan
Prior art keywords
resin
header
main surface
groove
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59125163A
Other languages
English (en)
Japanese (ja)
Other versions
JPS615529A (ja
Inventor
Minoru Suda
Masao Yamaguchi
Nobukatsu Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59125163A priority Critical patent/JPS615529A/ja
Publication of JPS615529A publication Critical patent/JPS615529A/ja
Publication of JPH0446456B2 publication Critical patent/JPH0446456B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/016—
    • H10W74/10—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59125163A 1984-06-20 1984-06-20 絶縁型半導体装置 Granted JPS615529A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59125163A JPS615529A (ja) 1984-06-20 1984-06-20 絶縁型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59125163A JPS615529A (ja) 1984-06-20 1984-06-20 絶縁型半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP1325668A Division JPH02290032A (ja) 1989-12-14 1989-12-14 レジンモールド型半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS615529A JPS615529A (ja) 1986-01-11
JPH0446456B2 true JPH0446456B2 (cg-RX-API-DMAC10.html) 1992-07-30

Family

ID=14903434

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59125163A Granted JPS615529A (ja) 1984-06-20 1984-06-20 絶縁型半導体装置

Country Status (1)

Country Link
JP (1) JPS615529A (cg-RX-API-DMAC10.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6115744U (ja) * 1984-06-30 1986-01-29 ロ−ム株式会社 半導体装置
EP0257681A3 (en) * 1986-08-27 1990-02-07 STMicroelectronics S.r.l. Method for manufacturing plastic encapsulated semiconductor devices and devices obtained thereby
US5197183A (en) * 1991-11-05 1993-03-30 Lsi Logic Corporation Modified lead frame for reducing wire wash in transfer molding of IC packages
US5252783A (en) * 1992-02-10 1993-10-12 Motorola, Inc. Semiconductor package
JP5161688B2 (ja) * 2008-07-30 2013-03-13 オンセミコンダクター・トレーディング・リミテッド 半導体装置および半導体モジュール

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5878654U (ja) * 1981-11-20 1983-05-27 日本電気株式会社 モ−ルド型半導体素子
JPS58187146U (ja) * 1982-06-04 1983-12-12 松下電子工業株式会社 半導体装置

Also Published As

Publication number Publication date
JPS615529A (ja) 1986-01-11

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