JPS6113400B2 - - Google Patents
Info
- Publication number
- JPS6113400B2 JPS6113400B2 JP15178375A JP15178375A JPS6113400B2 JP S6113400 B2 JPS6113400 B2 JP S6113400B2 JP 15178375 A JP15178375 A JP 15178375A JP 15178375 A JP15178375 A JP 15178375A JP S6113400 B2 JPS6113400 B2 JP S6113400B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- prepreg
- solution containing
- aqueous solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 23
- 239000011889 copper foil Substances 0.000 claims description 22
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 17
- 239000007864 aqueous solution Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 11
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 10
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 9
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 8
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 claims description 6
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 claims description 5
- 239000005695 Ammonium acetate Substances 0.000 claims description 5
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 5
- 229940043376 ammonium acetate Drugs 0.000 claims description 5
- 235000019257 ammonium acetate Nutrition 0.000 claims description 5
- 235000019270 ammonium chloride Nutrition 0.000 claims description 5
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 5
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 5
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 229960002218 sodium chlorite Drugs 0.000 claims description 5
- 239000001488 sodium phosphate Substances 0.000 claims description 5
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 5
- 229910000406 trisodium phosphate Inorganic materials 0.000 claims description 5
- 235000019801 trisodium phosphate Nutrition 0.000 claims description 5
- 229960003280 cupric chloride Drugs 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 235000011114 ammonium hydroxide Nutrition 0.000 claims 1
- 238000001035 drying Methods 0.000 claims 1
- 230000007547 defect Effects 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15178375A JPS5276679A (en) | 1975-12-22 | 1975-12-22 | Method of producing multiilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15178375A JPS5276679A (en) | 1975-12-22 | 1975-12-22 | Method of producing multiilayer printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5276679A JPS5276679A (en) | 1977-06-28 |
| JPS6113400B2 true JPS6113400B2 (zh) | 1986-04-12 |
Family
ID=15526191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15178375A Granted JPS5276679A (en) | 1975-12-22 | 1975-12-22 | Method of producing multiilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5276679A (zh) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56153797A (en) * | 1980-04-28 | 1981-11-27 | Hitachi Chemical Co Ltd | Method of manufacturing multilayer printed circuit board substrate |
| JPS5760897A (en) * | 1980-09-30 | 1982-04-13 | Shin Kobe Electric Machinery | Method of producing multilayer printed circuit board |
| JPS5944893A (ja) * | 1982-09-08 | 1984-03-13 | 日立化成工業株式会社 | 多層印刷回路板の製造法 |
| JPS5962113A (ja) * | 1982-09-30 | 1984-04-09 | Matsushita Electric Works Ltd | 多層板の製法 |
| JPS62109398A (ja) * | 1985-11-07 | 1987-05-20 | 日立エーアイシー株式会社 | 多層配線板の製造方法 |
| JPS62189155A (ja) * | 1986-02-14 | 1987-08-18 | 松下電工株式会社 | 金属箔張り積層板の製造方法 |
-
1975
- 1975-12-22 JP JP15178375A patent/JPS5276679A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5276679A (en) | 1977-06-28 |
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