JPS606236U - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS606236U JPS606236U JP1983098167U JP9816783U JPS606236U JP S606236 U JPS606236 U JP S606236U JP 1983098167 U JP1983098167 U JP 1983098167U JP 9816783 U JP9816783 U JP 9816783U JP S606236 U JPS606236 U JP S606236U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- cap
- glass
- ceramic substrate
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１図は従来の半導体装置の模式的構成図、第２図は本
考案の一実施例の模式的構成図である。 図において、２１はセラミック基板、２２゜２４はガラ
ス封止する接着面、２３はキャップ、２５．２６は凹凸
部を示す。
考案の一実施例の模式的構成図である。 図において、２１はセラミック基板、２２゜２４はガラ
ス封止する接着面、２３はキャップ、２５．２６は凹凸
部を示す。
Claims (1)
- 半導体チップを搭載するセラミック基板とキャップとの
間に複数のリードを保持し、両者をガラスで接着して成
り、少な（とも該セラミック基板と該キャップの一方の
接着面に、凹凸部が設けられていることを特徴とする半
導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983098167U JPS606236U (ja) | 1983-06-24 | 1983-06-24 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983098167U JPS606236U (ja) | 1983-06-24 | 1983-06-24 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS606236U true JPS606236U (ja) | 1985-01-17 |
Family
ID=30233193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983098167U Pending JPS606236U (ja) | 1983-06-24 | 1983-06-24 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS606236U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020136495A (ja) * | 2019-02-20 | 2020-08-31 | 中央電子工業株式会社 | 中空パッケージ構造およびその製造方法、ならびに半導体装置およびその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5111763B1 (ja) * | 1971-06-30 | 1976-04-14 |
-
1983
- 1983-06-24 JP JP1983098167U patent/JPS606236U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5111763B1 (ja) * | 1971-06-30 | 1976-04-14 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020136495A (ja) * | 2019-02-20 | 2020-08-31 | 中央電子工業株式会社 | 中空パッケージ構造およびその製造方法、ならびに半導体装置およびその製造方法 |
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