JPS59104535U - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS59104535U JPS59104535U JP19867882U JP19867882U JPS59104535U JP S59104535 U JPS59104535 U JP S59104535U JP 19867882 U JP19867882 U JP 19867882U JP 19867882 U JP19867882 U JP 19867882U JP S59104535 U JPS59104535 U JP S59104535U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- island
- package body
- semiconductor
- metallized layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/3201—Structure
- H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
- H01L2224/32013—Structure relative to the bonding area, e.g. bond pad the layer connector being larger than the bonding area, e.g. bond pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Die Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１図ａ、 ｂはそれぞれ従来の半導体装置のキャップ
封止前の平面図および断面図、第２図ａ。 ｂはそれぞれ本考案に係るパッケージ本体に半導体素子
を固着する前と後の状態を示した断面図である。
封止前の平面図および断面図、第２図ａ。 ｂはそれぞれ本考案に係るパッケージ本体に半導体素子
を固着する前と後の状態を示した断面図である。
Claims (1)
- 半導体素子をセラミック積層型のパッケージ本体のアイ
ランドに接着した半導体装置において、前記パッケージ
本体のアイランドの中央部で特に厚くしたメタライズ層
を設け、このメタライズ層により前記半導体素子を直接
接着したことを特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19867882U JPS59104535U (ja) | 1982-12-29 | 1982-12-29 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19867882U JPS59104535U (ja) | 1982-12-29 | 1982-12-29 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59104535U true JPS59104535U (ja) | 1984-07-13 |
Family
ID=30424243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19867882U Pending JPS59104535U (ja) | 1982-12-29 | 1982-12-29 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59104535U (ja) |
-
1982
- 1982-12-29 JP JP19867882U patent/JPS59104535U/ja active Pending
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